Abstract: A method for forming an integrated circuit assembly comprises forming first solder bumps on a first die, and forming a first structure comprising the first die, the first solder bumps, a first flux, and a first substratum. The first die is placed upon the first substratum. The first solder bumps are between the first die and the first substratum. The first flux holds the first die substantially flat and onto the first substratum.

Abstract: Methods and apparatus for forming an integrated circuit assembly are presented, for example, three dimensional integrated circuit assemblies. Lower height 3DIC assemblies due Use of, for example, thinned wafers, low-height solder bumps, and through silicon vias provide for low height three dimensional integrated circuit assemblies. For example, a method for forming an integrated circuit assembly comprises forming first solder bumps on a first die, and forming a first structure comprising the first die, the first solder bumps, a first flux, and a first substratum. The first die is placed upon the first substratum. The first solder bumps are between the first die and the first substratum. The first flux holds the first die substantially flat and onto the first substratum.

Abstract: A method for performing handover between multiple modes for a mobile station is provided. The method includes operating the mobile station in a first mode. A handover from the first mode to a second mode is performed using a single wireless receiver. The mobile station operates in the second mode after performing the handover.

Abstract: A reconfigurable RF transceiver for use in either a base station or a mobile station Of a wireless network. The reconfigurable RF transceiver comprises a first receive path that down-converts an incoming RF signal to analog and digital baseband signals. The first receive path in a first mode down-converts the incoming RF signal in a receive frequency band for the base station and in a second mode down-converts the incoming RF signal in a receive frequency band for the mobile station. The reconfigurable RF transceiver further comprises a transmit path for up-converting an outgoing baseband signal to an outgoing RF signal. The transmit path in the first mode up-converts the outgoing baseband signal in a transmit frequency band for the base station and in the second mode up-converts the outgoing baseband signal in a transmit frequency band for the mobile station.

Abstract: A ceramic column grid array package suitable for mounting application specific integrated circuits or microprocessor chips onto a printed circuit board employing polymer reinforced columns on the substrate module is described. The polymer enhancement is formed by coating a thin conformal film of a polymer, such as, a polyimide onto the substrate module after the formation of the ceramic column grids to mechanically enhance the column to substrate attachment of the column to the substrate prior to mounting on a printed circuit card. Upon curing of the polymer film at a temperature below the melting point of the solder bond attaching the column grid to the substrate, the columns will be mechanically reinforced in their attachment to the substrate. Upon removal of the substrate module from a printed circuit card during rework, the columns of the grid array will remain with the substrate module, leaving no columns on the printed circuit card.