Abstract: A computer-implemented method for determining a quantification of the deformation of the sample is implemented using a computer device in communication with a memory. The method includes receiving, by the computer device, a first image of the sample and a second image of the sample. The method also includes registering the first image to the second image using a warping function. The warping function maps a plurality of pixels in the first image to a plurality of pixels in the second image. A first displacement field for the sample is determined based on the warping function, where the first displacement field includes at least a portion of the warping function. A first quantification of the deformation of the sample is determined based at least in part on the displacement field.

Abstract: A computer-implemented method for determining a quantification of the deformation of the sample is implemented using a computer device in communication with a memory. The method includes receiving, by the computer device, a first image of the sample and a second image of the sample. The method also includes registering the first image to the second image using a warping function. The warping function maps a plurality of pixels in the first image to a plurality of pixels in the second image. A first displacement field for the sample is determined based on the warping function, where the first displacement field includes at least a portion of the warping function. A first quantification of the deformation of the sample is determined based at least in part on the displacement field.

Abstract: A computer-implemented method for determining a quantification of the deformation of the sample is implemented using a computer device in communication with a memory. The method includes receiving, by the computer device, a first image of the sample and a second image of the sample. The method also includes registering the first image to the second image using a warping function. The warping function maps a plurality of pixels in the first image to a plurality of pixels in the second image. A first displacement field for the sample is determined based on the warping function, where the first displacement field includes at least a portion of the warping function. A first quantification of the deformation of the sample is determined based at least in part on the displacement field.

Abstract: A computer-implemented method for determining a quantification of the deformation of the sample is implemented using a computer device in communication with a memory. The method includes receiving, by the computer device, a first image of the sample and a second image of the sample. The method also includes registering the first image to the second image using a warping function. The warping function maps a plurality of pixels in the first image to a plurality of pixels in the second image. A first displacement field for the sample is determined based on the warping function, where the first displacement field includes at least a portion of the warping function. A first quantification of the deformation of the sample is determined based at least in part on the displacement field.

Abstract: A star camera system that includes an optical system configured to focus radiation from a star to be imaged onto a collector. Specifically, the collector is in the form of an electron bombarded active pixel sensor (EBAPS) configured to provide high gain. The EBAPS comprising a photocathode disposed in a vacuum is configured to release electron into a vacuum when exposed to radiation focused thereon by the optical system. In addition, the EBAPS includes an active pixel sensor anode disposed distant from the photocathode in the vacuum. An electric field is generated by a voltage source to direct electrons from the photocathode to the active pixel sensor anode to thereby generate an image of the star.

Abstract: A star camera system that includes an optical system configured to focus radiation from a star to be imaged onto a collector that is in the form of an electron bombarded active pixel sensor (EBAPS) configured to provide high gain. The EBAPS comprising a photocathode disposed in a vacuum is configured to release electrons into the vacuum when exposed to radiation focused thereon by the optical system. The EBAPS includes an active pixel sensor anode disposed distant from the photocathode in the vacuum. An electric field is generated by a voltage source to direct the electrons from the photocathode to the active pixel sensor anode. Furthermore, the collector is mounted on a translation device configured to move the collector relative to the optical system by a predetermined amount of less than pixel size in the focal plane of the optical system to increase image resolution of a plurality of images.

Abstract: A computer-implemented method for determining a quantification of the deformation of the sample is implemented using a computer device in communication with a memory. The method includes receiving, by the computer device, a first image of the sample and a second image of the sample. The method also includes registering the first image to the second image using a warping function. The warping function maps a plurality of pixels in the first image to a plurality of pixels in the second image. A first displacement field for the sample is determined based on the warping function, where the first displacement field includes at least a portion of the warping function. A first quantification of the deformation of the sample is determined based at least in part on the displacement field.

Abstract: A star camera system that includes an optical system configured to focus radiation from a star to be imaged onto a collector that is in the form of an electron bombarded active pixel sensor (EBAPS) configured to provide high gain. The EBAPS comprising a photocathode disposed in a vacuum is configured to release electrons into the vacuum when exposed to radiation focused thereon by the optical system. The EBAPS includes an active pixel sensor anode disposed distant from the photocathode in the vacuum. An electric field is generated by a voltage source to direct the electrons from the photocathode to the active pixel sensor anode. Furthermore, the collector is mounted on a translation device configured to move the collector relative to the optical system by a predetermined amount of less than pixel size in the focal plane of the optical system to increase image resolution of a plurality of images.

Abstract: A star camera system that includes an optical system configured to focus radiation from a star to be imaged onto a collector. Specifically, the collector is in the form of an electron bombarded active pixel sensor (EBAPS) configured to provide high gain. The EBAPS comprising a photocathode disposed in a vacuum is configured to release electron into a vacuum when exposed to radiation focused thereon by the optical system. In addition, the EBAPS includes an active pixel sensor anode disposed distant from the photocathode in the vacuum. An electric field is generated by a voltage source to direct electrons from the photocathode to the active pixel sensor anode to thereby generate an image of the star.

Abstract: A device for destruction-free testing of ferromagnetic component walls with respect to elongate defects has a sending transducer that excites ultrasound waves in a wall area of a ferromagnetic component wall magnetized in a predetermined direction of magnetization. The ultrasound waves propagate on a path oriented by the sending transducer. A receiving transducer receives the ultrasound waves at a spacing from the sending transducer. The configuration of the sending transducer and a high frequency emitted by the sending transducer, which high frequency is to be determined based on a thickness of the ferromagnetic component wall, are selected so as to effect excitation of horizontal shear waves of higher order. The path orientation is selected at a slant angle to the predetermined direction of magnetization. The receiving transducer is positioned lateral to the path and is oriented toward a predetermined testing area of the wall section in the path.

Abstract: A device for destruction-free testing of ferromagnetic component walls with respect to elongate defects has a sending transducer that excites ultrasound waves in a wall area of a ferromagnetic component wall magnetized in a predetermined direction of magnetization. The ultrasound waves propagate on a path oriented by the sending transducer. A receiving transducer receives the ultrasound waves at a spacing from the sending transducer. The configuration of the sending transducer and a high frequency emitted by the sending transducer, which high frequency is to be determined based on a thickness of the ferromagnetic component wall, are selected so as to effect excitation of horizontal shear waves of higher order. The path orientation is selected at a slant angle to the predetermined direction of magnetization. The receiving transducer is positioned lateral to the path and is oriented toward a predetermined testing area of the wall section in the path.

Abstract: An integrated circuit (IC) die carrier assembly includes a thinned IC die mounted to a substrate or carrier. The IC die is mounted to the carrier via a thin layer of glass. The carrier facilitates fixturing and provides support during the lapping process used to thin the die. Ball bonding, wire bonding, thin film or thick film conductors can be used to interconnect the pads on the IC die to the pads on the carrier. The coefficients of the thermal expansion of the IC die and the carrier are closely matched to avoid damage to the IC die due to uneven expansion of the thinned IC die relative to the carrier. The IC die carrier assembly is better suited for ultrahigh vacuum and high temperature environments than conventional IC die carrier assemblies.

Abstract: An integrated circuit (IC) die carrier assembly includes a thinned IC die mounted to a substrate or carrier. The IC die is mounted to the carrier via a thin layer of glass. The carrier facilitates fixturing and provides support during the lapping process used to thin the die. Ball bonding, wire bonding, thin film or thick film conductors can be used to interconnect the pads on the IC die to the pads on the carrier. The coefficients of the thermal expansion of the IC die and the carrier are closely matched to avoid damage to the IC die due to uneven expansion of the thinned IC die relative to the carrier. The IC die carrier assembly is better suited for ultrahigh vacuum and high temperature environments than conventional IC die carrier assemblies.

Abstract: A door security system for the protection of a lock as well as a set of hinges both associated with a door wherein the security system includes a wrap-around cover plate covering surface portions of the exterior and interior of the door adjacent the lock and the lock side surface around the bolt plate of the lock. In addition, structures designed to protect each of the plurality of hinges serving to hang the door on the hinge jamb thereof include a wrap-around cover plate and hinge pin fittings on the inside of the door and a jamb plate and a vertical bar attached to an exterior section which includes a bar surface that is adjacent to a vertically extensive, exterior surface end region of the hinge cover plate when the door is closed.