Patents by Inventor John J. Clement

John J. Clement has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5382831
    Abstract: For enhanced resistance to electromigration failure, a thin metal film interconnect on an integrated circuit chip should use multiple parallel minimum-width lines when the minimum linewidth is less than one and one-half times the mean grain size of the metal film. When the interconnect is longer than a certain predetermined length, then the multiple lines of the interconnect should have intermediate interconnections or bridges between neighboring ones of the multiple lines. When the interconnect is many times longer than the predetermined length, then the bridges define slots between the neighboring lines, and the slots should have a length of about the predetermined length. When the interconnect is many times longer than the predetermined length and the interconnect has more than two parallel lines, then the slots on one side of a parallel line should be staggered or offset with respect to the slots on the other side of the parallel line.
    Type: Grant
    Filed: December 14, 1992
    Date of Patent: January 17, 1995
    Assignee: Digital Equipment Corporation
    Inventors: Eugenia M. Atakov, John J. Clement, Brian C. Lee