Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices.

Abstract: Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the first portion. The second portion is configured for mating engagement with an electronic substrate that includes an embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a first end of the first portion, with a plurality of corresponding waveguide cores of the embedded waveguide assembly. The first and second portions are further configured so as to align the plurality of optical waveguides, at a second end of the first portion, with a plurality of corresponding optical fibers in the optical fiber connector. Also provided are electronic assemblies and methods for coupling optical fibers with electronic substrate embedded waveguides.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: The present invention provides an optical switch. The switch includes a substrate and a first waveguide holding member. The switch also includes a second waveguide holding member disposed over the substrate and movable relative to the first waveguide holding member to provide a switching function. A movement guiding member is provided for guiding the movement of the second waveguide holding member. A registration element is disposed at the movement guiding member for positioning the second waveguide holding member at a selected location relative to the first waveguide holding member. The selected location is one that provides alignment between a selected waveguide of the first waveguide holding member and a selected waveguide of the second waveguide holding member.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Compositions and methods are provided to simulate the appearance of frozen beverages, such as fruit drink slushes or frozen coffees. The composition includes a carrier fluid which comprises water, a thickening agent, and a colorant; and simulated ice crystals stably and uniformly dispersed in the carrier fluid. The simulated ice crystals are comprised of particles, preferably polymeric particles having a size between about 200 and about 400 microns. The thickening agent preferably comprises a slurry of propylene glycol alginate dispersed in propylene glycol. The colorant is selected based on the “flavor” being simulated, for example, yellow for lemonade, caramel color for coffee or cola. The polymeric particles preferably comprise a polymer such as high density polyethylene.

Abstract: Compositions and methods are provided to simulate the appearance of frozen beverages, such as fruit drink slushes or frozen coffees. The composition includes a carrier fluid which comprises water, a thickening agent, and a colorant; and simulated ice crystals stably and uniformly dispersed in the carrier fluid. The simulated ice crystals are comprised of particles, preferably polymeric particles having a size between about 200 and about 400 microns. The thickening agent preferably comprises a slurry of propylene glycol alginate dispersed in propylene glycol. The colorant is selected based on the “flavor” being simulated, for example, yellow for lemonade, caramel color for coffee or cola. The polymeric particles preferably comprise a polymer such as high density polyethylene.

Abstract: A sealed fluid merchandiser (12) for use in connection with a beverage dispenser (16) includes a transparent, liquid display container (60) having a narrow liquid chamber (33) for a stable liquid (21) that simulates the beverage being dispensed and a pump housing (37) for a pump (38) that pumps the liquid being simulated through a spray manifold (44) for producing an attractive spray or bubbling effect. The stable, simulated beverage liquid has a low viscosity such that it behaves substantially identical to the beverage being dispensed. The narrow liquid chamber substantially reduces the weight and expense of the fluid merchandiser.

Abstract: An anchor for personal watercraft provides a generally cylindrical housing closed at a top end and enclosing a concavity formed through the opposite, bottom, diametral end. The opening of the concavity is defined by a circumferential edge of the housing, and may be further shaped or formed with a circumferential edge or with a central and/or a plurality of circumferential spikes to readily engage with any of a variety of materials found on the floor of a water body or beach. A weight may be removably attached to either the top side or within the concavity at the bottom side of the anchor, thereby functioning as additional ballast as may be necessary to overcome natural buoyancy of any air trapped in the concavity when the anchor is lowered into an anchoring position, or to overcome heavier seas.

Abstract: A method for impregnating porous material with a liquid flavoring. The porous material comprises embossed sheets or disks of porous absorbent material, each of which is dispensed automatically onto a conveyor. Each individual disk is squirted automatically with a selected amount of liquid flavoring and then immediately packaged automatically. The selected amount of flavoring is less than the amount required to supersaturate the disk. Thus, by a passive capillary action, or "wicking" effect, dispersal of the flavoring liquid throughout the disk continues during the packaging step. This method reduces the amount of flavoring which is wasted in conventional impregnation methods. Further, the use of the capillary action to complete the saturation process allows the packaging to be commenced prior to completion of the saturation process and thereby substantially increases the speed with which the process can be completed.

Abstract: A dual forearmed robotic elbow configuration comprises a main arm having a double elbow from which two coplanar forearms depend, two actuators carried in the double elbow for moving the forearms, and separate, independent end effectors, operated by a cable carried from the main arm through the elbow, is attached to the distal end of each forearm. Coiling the cables around the actuators prevents bending or kinking when the forearms are rotated 360 degrees. The end effectors can have similar or different capabilities. Actuator cannisters within the dual elbow are modular for rapid replacement or maintenance. Coarse and fine resolver transducers within the actuators provide accurate position referencing information.

Abstract: A process for the manufacture of instant fat-containing dry milk and flavored dry milk products. Anhydrous non-fat milk powder is used as a source material and fat in the form of a fat emulsion is added in the instantizing or agglomerating operation. The fat emulsion is one prepared in such a manner that it is stable with respect to reversal of the emulsion phase. In one processing step the anhydrous powder is treated in an agglomerating chamber to which is supplied separately atomized materials comprising fat emulsion and lecithin, accompanied by sufficient moisture to cause the milk particles to become sticky and to form random aggregates which incorporate the fat emulsion and the lecithin as extraneous lecithin. The aggregates are dried to produce the desired instant fat containing dry milk product.