Abstract: Described herein is a construction comprising a microsphere layer comprising a plurality of microspheres, wherein the microspheres comprise glass, ceramic, and combinations thereof; a bead bonding layer, wherein the plurality of microspheres is partially embedded in the bead bonding layer forming a first surface comprising exposed microspheres, wherein the plurality of microspheres on the first surface are truncated. Also disclosed herein are articles comprising the construction and methods of making thereof.

Abstract: A polishing system includes a substrate to be polished and a polishing pad. The polishing pad includes a base layer and a wear resistant layer. The system further includes a polishing solution disposed between the polishing pad and the substrate. The polishing solution includes a fluid component and a plurality of ceramic abrasive composites. The ceramic abrasive composites include individual abrasive particles uniformly dispersed throughout a porous ceramic matrix. At least a portion of the porous ceramic matrix includes glassy ceramic material. The ceramic abrasive composites are dispersed in the fluid component.

Abstract: An abrasive rotary tool includes a tool shank defining an axis of rotation for the rotary tool, and an abrasive external working surface. The abrasive external working surface includes a resin, and a plurality of porous ceramic abrasive composites dispersed in the resin, the porous ceramic abrasive composites including individual abrasive particles dispersed in a porous ceramic matrix. At least a portion of the porous ceramic matrix comprises glassy ceramic material. A ratio of the average porous ceramic abrasive composite size to the average individual abrasive particle size is no greater than 15 to 1.

Abstract: Described herein is a construction comprising a microsphere layer comprising a plurality of microspheres, wherein the microspheres comprise glass, ceramic, and combinations thereof; a bead bonding layer, wherein the plurality of microspheres is partially embedded in the bead bonding layer forming a first surface comprising exposed microspheres, wherein the plurality of microspheres on the first surface are truncated. Also disclosed herein are articles comprising the construction and methods of making thereof.

Abstract: A method of making conglomerate abrasive particles includes: providing agglomerate abrasive particles comprising mineral particles in a first vitreous binder; combining the agglomerate abrasive particles with a second vitreous binder material precursor to form precursor conglomerate abrasive particles; and heating the precursor conglomerate abrasive particles to convert the second vitreous binder material precursor into a second vitreous binder, different from the first vitreous binder, thereby forming the conglomerate abrasive particles. The first vitreous binder differs from the second vitreous binder by at least one of: i) elemental composition, or ii) an intrinsic physical property; and wherein the conglomerate abrasive particles can pass through a testing sieve having one-millimeter openings. Conglomerate abrasive particles preparable by the method, and abrasive articles containing them, are also disclosed.

Abstract: A method of making conglomerate abrasive particles includes: providing agglomerate abrasive particles comprising mineral particles in a first vitreous binder; combining the agglomerate abrasive particles with a second vitreous binder material precursor to form precursor conglomerate abrasive particles; and heating the precursor conglomerate abrasive particles to convert the second vitreous binder material precursor into a second vitreous binder, different from the first vitreous binder, thereby forming the conglomerate abrasive particles. The first vitreous binder differs from the second vitreous binder by at least one of: i) elemental composition, or ii) an intrinsic physical property; and wherein the conglomerate abrasive particles can pass through a testing sieve having one-millimeter openings. Conglomerate abrasive particles preparable by the method, and abrasive articles containing them, are also disclosed.

Abstract: An abrasive rotary tool includes a tool shank defining an axis of rotation for the rotary tool, and an abrasive external working surface. The abrasive external working surface includes a resin, and a plurality of porous ceramic abrasive composites dispersed in the resin, the porous ceramic abrasive composites including individual abrasive particles dispersed in a porous ceramic matrix. At least a portion of the porous ceramic matrix comprises glassy ceramic material. A ratio of the average porous ceramic abrasive composite size to the average individual abrasive particle size is no greater than 15 to 1.

Abstract: Interrupted structured abrasive articles comprise an abrasive layer comprising shaped abrasive composites that extend outwardly from a first major surface of a backing to which they are secured. The abrasive layer defines at least one open region that is free of the shaped abrasive composites and may extend partially or completely through the backing. In some embodiments, each of the open regions comprises a circular area of at least 1.5 square centimeters, and when combined the open regions have total area that is at least 10 percent of the area of the first major surface of the backing. Interrupted abrasive articles are useful in single-sided polishing processes.

Abstract: A polishing solution includes a fluid component and a plurality of conditioning particles. The fluid component includes water, a basic pH adjusting agent, and a polymeric thickening agent. The polymeric thickening agent is present in the fluid component at greater than 0.01 weight percent based on the total weight of the polishing solution.

Abstract: Interrupted structured abrasive articles comprise an abrasive layer comprising shaped abrasive composites that extend outwardly from a first major surface of a backing to which they are secured. The abrasive layer defines at least one open region that is free of the shaped abrasive composites and may extend partially or completely through the backing. In some embodiments, each of the open regions comprises a circular area of at least 1.5 square centimeters, and when combined the open regions have total area that is at least 10 percent of the area of the first major surface of the backing. Interrupted abrasive articles are useful in single-sided polishing processes.

Abstract: A method of making conglomerate abrasive particles includes: providing agglomerate abrasive particles comprising mineral particles in a first vitreous binder; combining the agglomerate abrasive particles with a second vitreous binder material precursor to form precursor conglomerate abrasive particles; and heating the precursor conglomerate abrasive particles to convert the second vitreous binder material precursor into a second vitreous binder, different from the first vitreous binder, thereby forming the conglomerate abrasive particles. The first vitreous binder differs from the second vitreous binder by at least one of: i) elemental composition, or ii) an intrinsic physical property; and wherein the conglomerate abrasive particles can pass through a testing sieve having one-millimeter openings. Conglomerate abrasive particles preparable by the method, and abrasive articles containing them, are also disclosed.

Abstract: The disclosure relates to chemical mechanical planarization (CMP) polishing compositions including proline and a fluorochemical surfactant. The wafer polishing composition may be used as a solution substantially free of abrasive particles, the composition of which can be adjusted to control Oxide Removal Rate and oxide over nitride Selectivity Ratio in Shallow Trench Isolation (STI) processing of semiconductor wafers using a fixed abrasive CMP process. In certain embodiments, the disclosure provides a working liquid for fixed abrasive CMP including proline and a fluorochemical surfactant at a pH from 9 to 11. When used in a fixed abrasive CMP system and method for STI, exemplary working liquids may yield an Oxide Removal Rate of at least 500 angstroms per minute, and an oxide over nitride Selectivity Ratio of at least 5.

Abstract: An abrasive article includes a support pad, a first abrasive element, a second abrasive element and a fixation mechanism. The support pad has a first major surface, a second major surface, a first edge, a second edge and a channel. The channel is formed within the first major surface and extends from the first edge to the second edge. The first and second abrasive elements are each positionable over a portion of the support pad. The fixation mechanism is positioned within the channel ad secures an edge of the first abrasive element and an edge of the second abrasive element to the support pad.

Abstract: A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.

Abstract: The method of the present invention comprises providing a wafer including a first, second and third material; contacting the third material in the presence of a working liquid with abrasive composites fixed to an abrasive article; and moving the wafer until an exposed surface of the wafer is substantially planar and comprises at least one area of exposed third material and one area of exposed second material. The components of the working liquid include an aqueous solvent; a pH buffer exhibiting a pKa greater than 7 and comprising a basic pH adjusting agent and a multidentate acidic complexing agent; and a non-ionic surfactant. The nonionic surfactant exhibits a hydrophile-lipophile balance of at least about 4. The working liquid is substantially free of loose abrasive particles and exhibits a pH of about 7-12.

Abstract: The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKa greater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.

Abstract: Structured fixed abrasive articles including a multiplicity of three-dimensional abrasive composites fixed to the abrasive article, the abrasive composites further including a multiplicity of ceria abrasive particles having a volume mean diameter from 100 to 500 nanometers (nm) in a matrix material, the matrix material further including a polymeric binder and a multiplicity of surface treated ceria filler particles having a volume mean diameter less than 100 nm. Also provided are methods of making and using structured fixed abrasive articles according to the disclosure.

Abstract: An abrasive article includes a support pad, a first abrasive element, a second abrasive element and a fixation mechanism. The support pad has a first major surface, a second major surface, a first edge, a second edge and a channel. The channel is formed within the first major surface and extends from the first edge to the second edge. The first and second abrasive elements are each positionable over a portion of the support pad. The fixation mechanism is positioned within the channel ad secures an edge of the first abrasive element and an edge of the second abrasive element to the support pad.

Abstract: A composition for use in polishing a wafer is disclosed. The composition includes an aqueous solution of initial components substantially free of loose abrasive particles and having a pH in the range of about 2 to 7, the aqueous solution including at least one polyelectrolyte and a surfactant. In certain embodiments, the wafer polishing composition can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive Chemical Mechanical Polishing (CMP) process. Also disclosed is a CMP method and a process for polishing a wafer using the polishing composition.

Abstract: A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.