Abstract: A bonding structure for a semiconductor substrate and related method are provided. The bonding structure includes a first oxide layer on the semiconductor substrate, and a second oxide layer on the first oxide layer, the second oxide layer for bonding to another structure. The second oxide layer has a higher stress level than the first oxide layer, and the second oxide layer is thinner than the first oxide layer. The second oxide layer may also have a higher density than the first oxide layer. The bonding structure can be used to bond chips to wafer or wafer to wafer and provides a greater bond strength than just a thick oxide layer.

Abstract: A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.

Abstract: One aspect of the disclosure relates to an integrated circuit structure. The integrated circuit structure may include a front side and back side opposing the front side, the integrated circuit structure comprising: a through-silicon-via (TSV) at least partially within a dielectric layer extending away from the front side; a first metal adjacent to the TSV and within the dielectric layer, the first metal being substantially surrounded by a first seed layer; a conductive pad over the first metal and the TSV and extending away from the front side, wherein the conductive pad provides electrical connection between the TSV and the first metal and includes a second seed layer substantially surrounding a second metal, wherein the second seed layer separates the second metal from the first metal and the TSV.

Abstract: A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.

Abstract: A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.

Abstract: A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

Abstract: A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of a workpiece. The sealing devices are positioned on opposing sides of the chamber outlet and on opposing sides of the vacuum device inlet, such that the sealing devices create at least a partial seal around a cavity defined by the workpiece and the cavity is beneath both the chamber outlet and the vacuum outlet.

Abstract: A structure including a stack of conformal layers on top of a dielectric layer and within an opening in the dielectric layer, the stack of layers including a first layer, a second layer, a third layer, and a fourth layer, each formed successively one on top of another with the first layer being in direct contact with the dielectric layer, and a conductive feature located directly on top of the fourth layer within the opening.

Abstract: A method including forming a stack of layers on top of a dielectric layer and within an opening in the dielectric layer, the stack of layers comprising a first layer, a second layer, a third layer, and a fourth layer, each formed successively one on top of another, removing a first portion of the fourth layer outside the opening to expose a portion of the third layer, a second portion of the fourth layer remains within the opening, filling the opening with a metal by applying an electrical potential to the second layer during an electroplating technique in which the metal plates out on the fourth layer but does not plate out on the third layer, and removing portions of the first layer, the second layer, and the third layer to expose an upper surface of the dielectric layer between the opening and an adjacent opening.

Abstract: A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.

Abstract: A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of a workpiece. The sealing devices are positioned on opposing sides of the chamber outlet and on opposing sides of the vacuum device inlet, such that the sealing devices create at least a partial seal around a cavity defined by the workpiece and the cavity is beneath both the chamber outlet and the vacuum outlet.

Abstract: A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

Abstract: A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads.

Abstract: A tool and method is provided for repositioning a solder injection head. The tool includes a first moveable platform positioned on a first side of a workpiece chuck and a second moveable platform positioned on a second side of the workpiece chuck. A solder injection head has a seal configured to seal molten solder within the solder injection head when contacting a surface of the first moveable platform or the second moveable platform. The method includes moving a workpiece chuck and a starting platform to a position such that the starting platform is at a finishing position and a finishing platform is in a starting position.

Abstract: A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads.

Abstract: A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.

Abstract: A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.

Abstract: A screening mask having a stress-relieving area including an inner functional area having a pattern which is replicated on an underlying substrate, the inner functional area pattern having an one open area through which a paste is extruded and at least one tab, and an outer nonfunctional area distinct from the inner functional area, the outer nonfunctional area having a stress-relieving area adjacent to an edge of the screening mask that protects the at least one tab in the inner functional area from breaking.

Abstract: A screening mask for screening an article, the screening mask including a screening mask body having a screening side and a nonscreening side, an one opening through the mask for screening at least one feature from the screening side to the nonscreening side, and a blind opening for protecting a previously screened feature. The blind opening is blocked on the screening side and open on the nonscreening side. The screening mask is used in double pass screening so that a second feature may be formed on the article without damaging a previously formed feature.

Abstract: A screening mask having a stress-relieving area including an inner functional area having a pattern which is replicated on an underlying substrate, the inner functional area pattern having an one open area through which a paste is extruded and at least one tab, and an outer nonfunctional area distinct from the inner functional area, the outer nonfunctional area having a stress-relieving area adjacent to an edge of the screening mask that protects the at least one tab in the inner functional area from breaking.

Abstract: A printing apparatus including a print mechanism for printing key-input print information; an eraser for erasing a character or symbol printed on a recording medium with the print mechanism; a first memory for storing the key-input information; a second memory for storing information on a print object erased with the eraser; and an erasure controller for controlling the eraser in accordance with a comparison result between the erased object information stored in the second memory and the key-input information stored in the first memory.