Abstract: Edge-emitting laser chip wafer layouts are provided that enable a variety of tests to be performed while the chips are on the wafer, including side-mode suppression ratio (SMSR) tests. The laser chip wafer layouts include turning mirrors that direct light passing out of at least one of the facets of the chips away from the wafer. Directing the light out of the wafer in this manner allows external test and measurement equipment to perform SMSR testing on the chips prior to singulation.

Abstract: The method comprises the steps of (a) inflicting a flaw on the glass surface of an optical glass fiber to be severed, (b) contacting an area about the fiber for applying pressure thereto which compresses the fiber, and (c) moving the contacted area along the fiber while applying sufficient pressure to produce frictional force which severs the fiber as the contacted area moves over the flaw.

Abstract: A scribing machine and method in which the fiber end projecting from a connector or other fiber holder is scribed and severed with a smooth, flat face having a mirror surface at a perpendicular angle to the fiber axis and at the precise length desired for the selected end use. The machine imparts a first preselected level of tension to the fiber during the scribing operation and a second preselected level of tension during the severing operation. The first level is below the tension needed to propagate a crack across the body of the fiber and the second level is above that level. The scribing operation is effected by a tool which is effective to score the surface of the fiber to generate a flaw during the scribing operation, and is withdrawn from engagement with the fiber during the severing operation so that the fiber is suspended without interference as the crack propagates from the flaw across its body.