Abstract: A lockout mechanism for a card assembly having a blind connection to an electronic component includes a card disposed in a housing and articulable in the housing in a direction substantially perpendicular to a direction of insertion of the card assembly into the electronic component, the card including a connector having connection fingers extending substantially in said direction. A lockout is disposed in the housing, the lockout movable in a direction perpendicular to the card between a first or locked position and a second or unlocked position, and preventing articulation of the card unless the one or more connection fingers are aligned with one or more corresponding component fingers in the electronic component. An alignment feature is included, that when brought into contact with a corresponding portion of the electronic component ensures proper alignment between the one or more connection fingers and one or more corresponding component fingers.

Abstract: An improved method and a cassette assembly for protecting electronic components, comprising of a housing that encloses the electronic components disposed over an insulator. The housing also encases a scissor jack component that can move from a first to a second position to enable actuation and unmating of the cassette assembly, such as to a next level of packaging. The housing has an overhang design, having complementary upper openings and lower cable shroud areas for supporting cable connections and for providing heat dissipation relief and EMC containment. Alternate designs provide for other components such as a honey comb screen and an EMC gasket to further enable EMC containment. In addition, other components such as an actuation trap door, a retention feature and card support members or support struts can be added to the design to enable better actuation and provide for an improved structural rigidity.

Abstract: Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.

Abstract: Disclosed is a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate situated on a printed circuit board. The multi-chip module also includes a molecular sieve desiccant chamber containing a quantity of molecular sieve desiccant and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board. The molecular sieve desiccant chamber is connected to the first cover via a first fluid pathway and a second fluid pathway.

Abstract: An aligning apparatus comprising: a back plane, the back plane comprising at least one back plane connector; at least one daughter card, the daughter card comprising: a lower edge, the lower edge comprising a scalloped surface proximal to a rear surface of the lower edge, and a ramped surface proximal to a front surface of the lower edge; and a daughter card connector, the daughter card connector configured to be removably connectable to the back plane connector; and at least two guide rails extending from the back plane, the guide rail comprising a rear ramp and a front ramp. A method of aligning a daughter card to a back plane, the method comprising: sliding the daughter card towards the back plane; lifting the front end of the daughter; lifting the back end of the daughter card after lifting the front end of the daughter card; and providing the back end of the daughter card with a degree of freedom to lift and lower in order to align to the back plane, after lifting the back end of the daughter card.

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.

Abstract: An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.

Abstract: An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.

Abstract: An exemplary embodiment of the invention is an actuation system including a printed circuit board having a plurality of interconnects and a compression connector positioned adjacent the printed circuit board and having a plurality of contacts for engaging the interconnects. A processing module is positioned adjacent the compression connector. The processing module has a base and a plurality of terminals for engaging contacts on the compression connector. An actuator includes a fastener that engages the base of the processing module and a biasing member for maintaining a force on the compression connector.

Abstract: An exemplary embodiment of the invention is an actuation system including a printed circuit board having a plurality of interconnects and a compression connector positioned adjacent the printed circuit board and having a plurality of contacts for engaging the interconnects. A processing module is positioned adjacent the compression connector. The processing module has a base and a plurality of terminals for engaging contacts on the compression connector. An actuator includes a fastener that engages the base of the processing module and a biasing member for maintaining a force on the compression connector.

Abstract: A cooling system for absorbing thermal energy from an integrated circuit device while preventing the formation of condensation thereon. The cooling system comprises a evaporator unit mounted on an integrated circuit device, housed within an airtight enclosure which is evacuated and then pressurized with dry air.

Abstract: A cold plate includes two flow-wise isolated coolant (or refrigerant) passages (or sets of passages) originating at the center of the cold plate and terminating at an edge for use in conjunction with separate refrigeration systems. The cold plate passages are centrally fed by the refrigeration system to create a cooling gradient radiating from the center of the cold plate to its edges. The center-fed cold plate provides a more even temperature gradient across the thermal source. The cold plate passages do not permit flow communication between distinct coolant (or refrigerant) paths. This permits two distinct cooling systems to operate either dually or in a redundant manner. Nonetheless, flow isolation is achieved while still maintaining tight thermal coupling between each path and the object, such as an electronic computer processor module, to be cooled.

Abstract: A cold plate includes two flow-wise isolated coolant (or refrigerant) passages (or sets of passages) originating at the center of the cold plate and terminating at an edge for use in conjunction with separate refrigeration systems. The cold plate passages are centrally fed by the refrigeration system to create a cooling gradient radiating from the center of the cold plate to its edges. The center-fed cold plate provides a more even temperature gradient across the thermal source. The cold plate passages do not permit flow communication between distinct coolant (or refrigerant) paths. This permits two distinct cooling systems to operate either dually or in a redundant manner. Nonetheless, flow isolation is achieved while still maintaining tight thermal coupling between each path and the object, such as an electronic computer processor module, to be cooled.