Abstract: Colored CTE modifiers may be added to a glass frit system to modify the CTE of a resulting fired enamel. The CTE modifier is colored. The colored CTE modifier may include a modified Pseudo-Brookite type material having a formula Al2TiO5, where Al and/or Ti are partially substituted with one or more coloring ions including Fe, Cr, Mn, Co, Ni, and Cu; a modified Cordierite type material having a formula Mg2Al4Si5O18, wherein Mg and/or Al is partially substituted with one or more of the coloring ions; a Perovskite type material having a formula Sm1?xSrxMnO3??, where x=0.0-0.5 and ?=0.0-0.25, or a modified version of the Perovskite type material wherein Sr is partially substituted with Ba and/or Ca; a modified magnesium pyrophosphate type material having a formula Mg2P2O7 wherein Mg is substituted with Co and/or Zn ions; or combinations thereof.

Abstract: A marking composition for forming marks or indicia on a substrate is provided for laser marking applications. The composition includes a glass frit, a carrier, and absorber particles. The glass frit includes alkali metal oxides, glass forming oxides, and one or more transition metal oxides. The glass frit is devoid of at least one of bismuth and zinc.

Abstract: Conductive thick film compositions compatible to aluminum nitride, alumina and silicon nitride substrates for microelectronic circuit application. The conductive thick film composition includes first copper powder, second copper powder, and glass component. The conductive thick film composition further includes CU2O, Ag, and at least one metal element selected from Ti, V, Zr, Mn, Cr, Co, and Sn. After firing, the conductive thick film composition exhibit improved sheet resistivity, and improved adhesion with underlying substrate.

Abstract: A sintered machinable glass-ceramic is provided. The machinable glass-ceramic is formed by mixing phyllosilicate material having a sheet structure, with a glass fit and firing the mixture at relatively low temperatures to sinter the phyllosilicate, while maintaining the sheet-like morphology of the phyllosilicate and its associated cleaving properties. The sintered machinable glass-ceramic can be machined with conventional metal working tools and includes the electrical properties of the phyllosilicate. Producing the sintered machinable glass-ceramic does not require the relatively high-temperature bulk nucleation and crystallization needed to form sheet phyllosilicate phases in situ.

Abstract: Modified copper chromite spinel pigments exhibit lower coefficients of thermal expansion than unmodified structures. Three methods exist to modify the pigments: (1) the incorporation of secondary modifiers into the pigment core composition, (2) control of the pigment firing profile, including both the temperature and the soak time, and (3) control of the pigment core composition.

Abstract: Modified copper chromite spinel pigments exhibit lower coefficients of thermal expansion than unmodified structures. Three methods exist to modify the pigments: (1) the incorporation of secondary modifiers into the pigment core composition, (2) control of the pigment firing profile, including both the temperature and the soak time, and (3) control of the pigment core composition.

Abstract: A method of modifying glass frit involves treating the frit with a grain-boundary-healing compound. The method increases transmission and clarity, and reduces haze of a fired enamel coating made from such modified glass frit as compared to a coating not made from such modified glass frit. The grain-boundary-healing compound influences the chemistry at the grain boundaries to prevent haze. The compound burns out to yield a fluxing material that dissolves alkaline carbonates or bicarbonates on the surface of the glass frit. The dissolved species are incorporated into the enamel coating, thereby promoting the fusion of the glass frit and reducing the amount of haze in the enamel coating. The additives also function to prevent the formation of seed crystals on the surface of the glass frit that may inhibit the fusion of the glass frit.

Abstract: A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950° C. or below 1100° C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO2, 5-35 mole % or 0.1-35 mole % B2O3, 0.1-10 mole % or 0.1-25 mole % Al2O3, 0.1-10 mole % K2O, 0.1-10 mole % Na2O, 0.1-20 mole % Li2O, 0.1-30 mole % F. The total amount of Li2O+Na2O+K2O is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.

Abstract: A passivation glass coating composition is provided for forming a fired passivation glass layer on a semiconductor substrate having p-n junction. The passivation glass coating composition includes a glass component that is lead free, cadmium free, alkali metal oxides free, and colored transition metal oxides (i.e. metal oxides of V, Fe, Co, Ni, Cr, Cu, Mn) free. The glass component includes bismuth based glasses, and provides a firing temperature range of 500° C. to 900° C., and controlled devitrification. Once fired to a semiconductor device, the fired passivation glass layer provides exceptional device performance including no cracking of the fired passivation glass layer, excellent thermal expansion matching to silicon, good chemical resistance to acid and base, and improved device performance.

Abstract: A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950° C. or below 1100° C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO2, 5-35 mole % or 0.1-35 mole % B2O3, 0.1-10 mole % or 0.1-25 mole % Al2O3, 0.1-10 mole % K2O, 0.1-10 mole % Na2O, 0.1-20 mole % Li2O, 0.1-30 mole % F. The total amount of Li2O+Na2O+K2O is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.

Abstract: A passivation glass coating composition is provided for forming a fired passivation glass layer on a semiconductor substrate having p-n junction. The passivation glass coating composition includes a glass component that is lead free, cadmium free, alkali metal oxides free, and colored transition metal oxides (i.e. metal oxides of V, Fe, Co, Ni, Cr, Cu, Mn) free. The glass component includes bismuth based glasses, and provides a firing temperature range of 500° C. to 900° C., and controlled devitrification. Once fired to a semiconductor device, the fired passivation glass layer provides exceptional device performance including no cracking of the fired passivation glass layer, excellent thermal expansion matching to silicon, good chemical resistance to acid and base, and improved device performance.

Abstract: A sintered machinable glass-ceramic is provided. The machinable glass-ceramic is formed by mixing phyllosilicate material having a sheet structure, with a glass fit and firing the mixture at relatively low temperatures to sinter the phyllosilicate, while maintaining the sheet-like morphology of the phyllosilicate and its associated cleaving properties. The sintered machinable glass-ceramic can be machined with conventional metal working tools and includes the electrical properties of the phyllosilicate. Producing the sintered machinable glass-ceramic does not require the relatively high-temperature bulk nucleation and crystallization needed to form sheet phyllosilicate phases in situ.

Abstract: A method of sealing at least two inorganic substrates together using an induction energy source comprising applying to at least one of the substrates a paste composition including a glass frit, and an induction coupling additive, bringing at least a second substrate into contact with the paste composition, and subjecting the substrates and paste to induction heating, thereby forming a hermetic seal between the two inorganic substrates.

Abstract: LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a matrix of titanates of alkaline earth metals, the matrix doped with at least one selected from rare-earth element, aluminum oxide, silicon oxide and bismuth oxide.

Abstract: The glass composites include glass frit, that when sintered produce a phosphor-containing layer, suitable for use in optical applications. The glass composites can include a crystallizing glass frit, such that phosphor crystals precipitate from the frit composite during sintering, or can include a non-crystallizing glass composition, such that phosphor is added to the frit composite before sintering. The sintering temperatures of the glass are relatively low so that fluorescence of the phosphors will not substantially degrade during sintering. The resulting phosphor-containing layer can be used in various optical applications including those for converting blue light into various color temperatures of white light.

Abstract: A method of modifying glass frit involves treating the frit with a grain-boundary-healing compound. The method increases transmission and clarity, and reduces haze of a fired enamel coating made from such modified glass frit as compared to a coating not made from such modified glass frit. The grain-boundary-healing compound influences the chemistry at the grain boundaries to prevent haze. The compound burns out to yield a fluxing material that dissolves alkaline carbonates or bicarbonates on the surface of the glass frit. The dissolved species are incorporated into the enamel coating, thereby promoting the fusion of the glass frit and reducing the amount of haze in the enamel coating. The additives also function to prevent the formation of seed crystals on the surface of the glass frit that may inhibit the fusion of the glass frit.

Abstract: LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a matrix of titanates of alkaline earth metals, the matrix doped with at least one selected from rare-earth element, aluminum oxide, silicon oxide and bismuth oxide.

Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

Abstract: Glasses comprising Bi203, ZnO B203 and optionally a colorant including an oxide of a metal such as iron, cobalt, manganese, nickel, copper and chromium are suitable to form hermetic seals in solar cell modules, architectural glass windows and MEMS devices. Glass frit and paste compositions suitable for flow and bonding to various substrates—glass, metal, silicon, in the temperature range of 400-500 degrees Centigrade. The broad compositional range in mole % is 25-70% Bi203, up to 65% ZnO, and 1-70% B203. Such glasses do not have batched in alumina or silica. Such glasses lack alumina and silica.

Abstract: Broadband infrared radiation is used to heat and fuse an enamel paste to form an enamel seal between at least two solid substrates such as glass, ceramic or metal.