Patents by Inventor John J. Pessarchick

John J. Pessarchick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Use of blind vias for soldered interconnections between substrates and printed wiring boards
    Patent number: 6452116
    Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of placing one or more blind vias in a first substrate positioned on top of a first conductor; placing one or more blind vias in a second substrate positioned under a second conductor; attaching one or more signal lines to one or more of the one or more blind vias; and assembling ball grid array components such that the first conductor is electrically connected to the second conductor. Also claimed is an electronic circuit package incorporating the blind vias for electrical connection between layers in accordance with the present invention.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: September 17, 2002
    Assignee: International Business Machines Corporation
    Inventors: Gregg J. Armezzani, Kishor V. Desai, Jeffrey S. Perkins, John J. Pessarchick
  • Method of electrically connecting substrates using solder balls
    Patent number: 6272742
    Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of placing one or more blind vias in a first substrate positioned on top of a first conductor; placing one or more blind vias in a second substrate positioned under a second conductor; attaching one or more signal lines to one or more of the one or more blind vias; and assembling ball grid array components such that the first conductor is electrically connected to the second conductor. Also claimed is an electronic circuit package incorporating the blind vias for electrical connection between layers in accordance with the present invention.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: August 14, 2001
    Assignee: International Business Machines Corporation
    Inventors: Gregg J. Armezzani, Kishor V. Desai, Jeffery S. Perkins, John J. Pessarchick
  • Use of blind vias for soldered interconnections between substrates and printed wiring boards
    Publication number: 20010010628
    Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of placing one or more blind vias in a first substrate positioned on top of a first conductor; placing one or more blind vias in a second substrate positioned under a second conductor; attaching one or more signal lines to one or more of the one or more blind vias; and assembling ball grid array components such that the first conductor is electrically connected to the second conductor. Also claimed is an electronic circuit package incorporating the blind vias for electrical connection between layers in accordance with the present invention.
    Type: Application
    Filed: February 28, 2001
    Publication date: August 2, 2001
    Applicant: International Business Machines Corporation
    Inventors: Gregg J. Armezzani, Kishor V. Desai, Jeffery S. Perkins, John J. Pessarchick
  • Use of blind vias for soldered interconnections between substrates and printed wiring boards
    Patent number: 6023029
    Abstract: A method is provided for connecting two conductive layers in an electronic circuit package including the steps of placing one or more blind vias in a first substrate positioned on top of a first conductor; placing one or more blind vias in a second substrate positioned under a second conductor; attaching one or more signal lines to one or more of the one or more blind vias; and assembling ball grid array components such that the first conductor is electrically connected to the second conductor. Also claimed is an electronic circuit package incorporating the blind vias for electrical connection between layers in accordance with the present invention.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: February 8, 2000
    Assignee: International Business Machines Corporation
    Inventors: Gregg J. Armezzani, Kishor V. Desai, Jeffery S. Perkins, John J. Pessarchick