Abstract: A method and system for removing an 8-inch semiconductor wafer from a final polishing pad of a Chemical Mechanical Polishing machine is disclosed. The polishing machine includes a rotating platen, and a polishing pad affixed thereto for rotation therewith. Moreover, the machine includes a generally-cylindrical carrier portion rotatable about an axis of rotation for receiving and retaining the semiconductor wafer. During normal operation, the platen and carrier both rotate about their respective axes of rotation, while, in addition, the carrier is oscillated by a mechanical arm along the surface of the polishing pad in a substantially radial path, relative to the axis of the platen. Prior to removing the wafer, the platen and carrier rotation is discontinued, while the radial movement of the carrier is allowed to continue for predetermined number of oscillations during a predetermined time to thereby dissipate adhesion forces inhibiting removal of the wafer.

Abstract: A counterflow evaporative heat exchanger employs parallel vertical uninterrupted coil containing sections having the sides thereof arranged to increase the area of liquid contact within the tubes, the smooth flow of a liquid film on the outside of the tubes, and to increase the impingement of gases against the outsides of the tubes thereby providing smooth liquid flow the full vertical length of each section and permitting the use of maximum air velocity with turbulence but with a minimum of liquid entrainment in the gas stream, thereby enhancing cooling of the internal liquid and reducing the space required for the coil assembly.