Patents by Inventor John J. Tierney

John J. Tierney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10098414
    Abstract: The improved footwear system of the present application uses composite materials in the design of an advanced modular in-shoe foot orthosis and a new container assembly which includes a high performance energy storage and return element orthosis. The footwear system uses a method of manufacture incorporating a new last model. The advantages of the footwear system over standard issue combat boots include lower weight, improved treatment of lower extremity overuse injuries and reduction of the occurrence of such overuse injuries by protecting at-risk feet with advanced footwear which can be customized to meet the biomechanical needs as well as the specific activities of the wearer.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: October 16, 2018
    Assignees: DIAPEDIA, LLC, UNIVERSITY OF DELAWARE
    Inventors: Peter R. Cavanagh, Timothy B. Hurley, John J. Tierney, John W. Gillespie, Jr.
  • Publication number: 20140298682
    Abstract: The improved footwear system of the present application uses composite materials in the design of an advanced modular in-shoe foot orthosis and a new container assembly which includes a high performance energy storage and return element orthosis. The footwear system uses a method of manufacture incorporating a new last model. The advantages of the footwear system over standard issue combat boots include lower weight, improved treatment of lower extremity overuse injuries and reduction of the occurrence of such overuse injuries by protecting at-risk feet with advanced footwear which can be customized to meet the biomechanical needs as well as the specific activities of the wearer.
    Type: Application
    Filed: March 6, 2014
    Publication date: October 9, 2014
    Applicants: UNIVERSITY OF DELAWARE, DIAPEDIA, LLC
    Inventors: Peter R. Cavanagh, Timothy B. Hurley, John J. Tierney, John W. Gillespie, JR.
  • Patent number: 7419373
    Abstract: A method and apparatus for forming laminate composite structures. At least two laminae, each containing electrically conductive reinforcing fibers, are placed upon each other in contacting relationship to form a generally layered structure. The layered structure may be subjected to heat to conductively transfer heat through the layered structure and thereby improve the surface contact between the two laminae. The layered structure is volumetrically heated by inductively transferring energy to the electrically conductive reinforcing fibers. The heated, layered structure is consolidated, such as by applying pressure and reducing the temperature of the layered structure. The consolidated structure is then quenched by rapidly cooling the consolidated structure in a directionally controlled manner about a midplane thereof.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: September 2, 2008
    Assignee: Alliant Techsystems Inc.
    Inventors: Jack K. Gerhard, Eric J. Lynam, Mark R. Shaffer, Shridhar Yariagadda, Nicholas B. Shevchenko, Bruce K. Fink, Dirk Heider, John J. Tierney, John W. Gillespie, Jr.
  • Patent number: 6881374
    Abstract: A method and apparatus for forming laminate composite structures. At least two laminae, each containing electrically conductive reinforcing fibers, are placed upon each other in contacting relationship to form a generally layered structure. The layered structure may be subjected to heat to conductively transfer heat through the layered structure and thereby improve the surface contact between two laminae. The layered structure is volumetrically heated by inductively transferring energy to the electrically conductive reinforcing fibers. The heated, layered structure is consolidated, such as by applying pressure and reducing the temperature of the layered structure. The consolidated structure is then quenched by rapidly cooling the consolidated structure in a directionally controlled manner about a midplane thereof.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: April 19, 2005
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Jack K. Gerhard, Eric J. Lynam, Mark R. Shaffer, Shridhar Yariagadda, Nicholas B. Shevchenko, Bruce K. Fink, Dirk Heider, John J. Tierney, John W. Gillespie, Jr.
  • Publication number: 20030062118
    Abstract: A method and apparatus for forming laminate composite structures. At least two laminae, each containing electrically conductive reinforcing fibers, are placed upon each other in contacting relationship to form a generally layered structure. The layered structure may be subjected to heat to conductively transfer heat through the layered structure and thereby improve the surface contact between the two laminae. The layered structure is volumetrically heated by inductively transferring energy to the electrically conductive reinforcing fibers. The heated, layered structure is consolidated, such as by applying pressure and reducing the temperature of the layered structure. The consolidated structure is then quenched by rapidly cooling the consolidated structure in a directionally controlled manner about a midplane thereof.
    Type: Application
    Filed: September 24, 2002
    Publication date: April 3, 2003
    Inventors: Jack K. Gerhard, Eric J. Lynam, Mark R. Shaffer, Shridhar Yariagadda, Nicholas B. Shevchenko, Bruce K. Fink, Dirk Heider, John J. Tierney, John W. Gillespie
  • Patent number: D814161
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: April 3, 2018
    Assignees: DIAPEDIA, LLC, UNIVERSITY OF DELAWARE
    Inventors: Peter R. Cavanagh, Timothy B. Hurley, John J. Tierney, John W. Gillespie, Jr.