Patents by Inventor John J. Todd, Jr.

John J. Todd, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling system for electronics with improved thermal interface
    Patent number: 6883594
    Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: April 26, 2005
    Assignee: Thermal Corp.
    Inventors: David B. Sarraf, Robert E. DeHoff, John Hartenstine, John J. Todd, Jr.
  • Heat pipe system for cooling flywheel energy storage systems
    Patent number: 6808011
    Abstract: A system for cooling a canister has first, second and third heat pipes. The first heat pipe has an evaporator and a condenser. The first heat pipe is mounted with its evaporator inside the canister and its condenser outside the canister. The second heat pipe has an evaporator conductively coupled to the condenser of the first heat pipe. The second heat pipe has a condenser. The third heat pipe has an evaporator conductively coupled to the condenser of the second heat pipe. The third heat pipe has a condenser with a plurality of fins on the condenser of the third heat pipe.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: October 26, 2004
    Assignee: Thermal.Corp.
    Inventors: James E. Lindemuth, Brian E. Mast, Nelson J. Gernert, James L. Smith, Jr., John J. Todd, Jr.