Abstract: Printed circuit boards with relatively high line speeds (for example, about one giga bit per second and above) are increasingly being developed. However, at these high line speeds problems arise with via-induced spurious modes being generated and propagating and reflecting along power or ground planes within the printed circuit board. This is problematic because any active devices which reference power or ground during the presence of such a spurious mode experience a change in the reference potential. This can lead to incorrect data reception or transmission. A resistive coating is applied to the edge of a printed circuit board, directly connected to the ground planes and capacitively connected to the power planes. This resistive coating acts to absorb spurious modes and prevent these from reflecting. In addition, the capacitive connection between the power planes and the resistive coating is enhanced, for example, using metallic flanges.

Abstract: The present invention is directed to a propellant composition made from a lacquer, the lacquer comprising: (a) from about 15 to about 70 wt % of an organic solvent; (b) from about 0.1 to about 2.5 wt % of a stabilizer; (c) optionally, from about 0% to about 40 wt % of an energetic plasticizer; (d) optionally, from about 0 to about 10 wt % of a nonenergetic plasticizer; (e) optionally, from about 0 to about 10 wt % water; (f) optionally, from about 0 to about 15 wt % of additional additives; and balance being nitrocellulose; all weight percents based on the total weight of the composition, and wherein the lacquer has a viscosity of less than 10 million centipoise when processed. The present invention is also directed to an efficient and safe method of making perforated propellant grains using the above lacquer composition, as well as propellant grains having ellipsoidal cross sections or outwardly extending ridges.

Abstract: The present invention is directed to a propellant composition made from a lacquer, the lacquer comprising: (a) from about 15 to about 70 wt % of an organic solvent; (b) from about 0.1 to about 2.5 wt % of a stabilizer; (c) optionally, from about 0% to about 40 wt % of an energetic plasticizer; (d) optionally, from about 0 to about 10 wt % of a nonenergetic plasticizer; (e) optionally, from about 0 to about 10 wt % water; (f) optionally, from about 0 to about 15 wt % of additional additives; and balance being nitrocellulose; all weight percents based on the total weight of the composition, and wherein the lacquer has a viscosity of less than 10 million centipoise when processed. The present invention is also directed to an efficient and safe method of making perforated propellant grains using the above lacquer composition, as well as propellant grains having ellipsoidal cross sections or outwardly extending ridges.

Abstract: There is provided a decoppering agent that is added to a propellant charge to remove copper from the rifling of the internal bore of a gun barrel. The decoppering agent consists essentially of a lead-free pulverized additive dispersed in a combustible binder. One suitable decoppering agent is pulverized bismuth metal, dispersed in a nitrocellulose binder. The bismuth metal either vaporizes or liquifies when the propellant charge is ignited and either embrittles or dissolves the copper deposits facilitating removal.