Patents by Inventor John Jackowski

John Jackowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260201215
    Abstract: An adhesive sheet is provided having an expandable adhesive layer having a foaming agent and excellent thermal conductivity after foaming curing. The adhesive sheet comprises a substrate, a first adhesive layer disposed on one surface of the substrate, and a second adhesive layer disposed on the other side of the substrate. The first adhesive layer comprises an adhesive (A), a thermally conductive filler (B) having a mean short side length of 1 ?m or more, and a foaming agent (C). The thermally conductive filler (B) has an aspect ratio of 1.3 or more and includes a filler (B-1). The second adhesive layer contains an adhesive (A?), a thermally conductive filler (B?) having a mean short side length of 1 ?m or more, and a foaming agent (C?). The thermally conductive filler (B?) p comprises a filler (B?-1) having an aspect ratio of 1.3 or more.
    Type: Application
    Filed: December 6, 2023
    Publication date: July 16, 2026
    Inventors: Haruna Mizumachi, Kengo Imamura, Jens Eichler, Patricia J. Tegeder, John Jackowski