Abstract: Techniques for a circuit board for an input device are described. In at least some embodiments, an input device is integrated into a circuit board of an apparatus. For instance, a touch interaction region of the input device is formed by cutting and/or etching a portion of the circuit board such that the touch interaction region is moveable with respect to adjacent portions of the circuit board. According to one or more embodiments, an input device includes a switch such that movement of the touch interaction region actuates the switch to generate a click input event.

Abstract: A backlit device includes an outer layer, an adhesive layer, and a light guide configured to transmit light from a light source. The adhesive layer is positioned between the outer layer and the light guide. The outer layer includes a plurality of outer layer segments and at least one opening positioned between the outer layer segments where light from the light guide can pass through and provide backlighting. The adhesive layer includes a plurality of adhesive material segments. Each adhesive material segment is individually positioned between an outer layer segment and the light guide such that the perimeter of an outer layer segment surrounds the perimeter of the respective adhesive material segment. Through this arrangement, the adhesive material segments do not divert or block light passing through the opening in the outer layer.

Abstract: Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.

Abstract: A backlit device includes an outer layer, an adhesive layer, and a light guide configured to transmit light from a light source. The adhesive layer is positioned between the outer layer and the light guide. The outer layer includes a plurality of outer layer segments and at least one opening positioned between the outer layer segments where light from the light guide can pass through and provide backlighting. The adhesive layer includes a plurality of adhesive material segments. Each adhesive material segment is individually positioned between an outer layer segment and the light guide such that the perimeter of an outer layer segment surrounds the perimeter of the respective adhesive material segment. Through this arrangement, the adhesive material segments do not divert or block light passing through the opening in the outer layer.

Abstract: A backlit device includes an outer layer, an adhesive layer, and a light guide configured to transmit light from a light source. The adhesive layer is positioned between the outer layer and the light guide. The outer layer includes a plurality of outer layer segments and at least one opening positioned between the outer layer segments where light from the light guide can pass through and provide backlighting. The adhesive layer includes a plurality of adhesive material segments. Each adhesive material segment is individually positioned between an outer layer segment and the light guide such that the perimeter of an outer layer segment surrounds the perimeter of the respective adhesive material segment. Through this arrangement, the adhesive material segments do not divert or block light passing through the opening in the outer layer.

Abstract: Techniques for a circuit board for an input device are described. In at least some embodiments, an input device is integrated into a circuit board of an apparatus. For instance, a touch interaction region of the input device is formed by cutting and/or etching a portion of the circuit board such that the touch interaction region is moveable with respect to adjacent portions of the circuit board. According to one or more embodiments, an input device includes a switch such that movement of the touch interaction region actuates the switch to generate a click input event.

Abstract: Techniques for a touch input in a circuit board are described. In at least some embodiments, a touch input device is integrated into a circuit board of an apparatus. For instance, a touch interaction region of the touch input device is formed by cutting and/or etching a portion of the circuit board such that the touch interaction region is moveable with respect to adjacent portions of the circuit board. According to one or more embodiments, a touch input device includes a switch such that movement of the touch interaction region actuates the switch to generate a click input event.

Abstract: Techniques for a touch input in a circuit board are described. In at least some embodiments, a touch input device is integrated into a circuit board of an apparatus. For instance, a touch interaction region of the touch input device is formed by cutting and/or etching a portion of the circuit board such that the touch interaction region is moveable with respect to adjacent portions of the circuit board. According to one or more embodiments, a touch input device includes a switch such that movement of the touch interaction region actuates the switch to generate a click input event.

Abstract: Techniques for a touch input device in a circuit board are described. In at least some embodiments, a touch input device is integrated into a circuit board of an apparatus. For instance, a touch interaction region of the touch input device is formed by cutting and/or etching a portion of the circuit board such that the touch interaction region is moveable with respect to adjacent portions of the circuit board. According to one or more embodiments, a touch input device includes a switch such that movement of the touch interaction region actuates the switch to generate a click input event.

Abstract: Techniques for fabric adhesion to an apparatus are described. According to one or more embodiments, an apparatus is laminated with fabric utilizing one or more fabric layers. In at least some embodiments, multiple adhesive zones are defined on a fabric layer. Each adhesive zone, for instance, has a particular set of properties, such as a particular location on a fabric layer, a particular adhesive thickness, a particular adhesive type, and so forth. In at least some embodiments, different adhesive zones differ from one another based on one or more of their respective properties and thus enable different fabric characteristics to be specified at different adhesive zones.

Abstract: A piezoelectric haptic feedback structure disclosed herein includes a supporting base defining a cavity and a piezoelectric actuator assembly at least partially suspended within the cavity. A perimeter hinge secures a perimeter portion of the piezoelectric actuator assembly while permitting movement of a central portion of a piezoelectric actuator. The piezoelectric actuator haptic feedback structure further includes a force-communicating structure that communicates haptic feedback responsive to movement of the central portion of the piezoelectric actuator assembly within the cavity.

Abstract: Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.

Abstract: Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.

Abstract: A backlit device includes an outer layer, an adhesive layer, and a light guide configured to transmit light from a light source. The adhesive layer is positioned between the outer layer and the light guide. The outer layer includes a plurality of outer layer segments and at least one opening positioned between the outer layer segments where light from the light guide can pass through and provide backlighting. The adhesive layer includes a plurality of adhesive material segments. Each adhesive material segment is individually positioned between an outer layer segment and the light guide such that the perimeter of an outer layer segment surrounds the perimeter of the respective adhesive material segment. Through this arrangement, the adhesive material segments do not divert or block light passing through the opening in the outer layer.

Abstract: Combined sensor systems are described. In one or more implementations, an input device includes a sensor substrate having conductors and a flexible contact layer spaced apart from the sensor substrate. The input device includes a combined sensor system having a capacitive sensor assembly to detect a location of an object proximate to a capacitive sensor and a pressure sensitive sensor assembly configured to detect an amount of pressure applied against a pressure sensitive sensor. The pressure sensitive sensors are interspersed with capacitive sensors in a geometric pattern that enables isolation of signals for pressure detection and capacitive sensing. The combined sensor system includes support structures proximate to the pressure sensitive sensors for pre-load control over force sensitive resistors of the flexible contact layer. The combined sensor system also includes adhesive disposed in association with positions of the capacitive sensors to stabilize capacitive sensing under the influence of pressure.

Abstract: Techniques for fabric adhesion to an apparatus are described. According to one or more embodiments, an apparatus is laminated with fabric utilizing one or more fabric layers. In at least some embodiments, multiple adhesive zones are defined on a fabric layer. Each adhesive zone, for instance, has a particular set of properties, such as a particular location on a fabric layer, a particular adhesive thickness, a particular adhesive type, and so forth. In at least some embodiments, different adhesive zones differ from one another based on one or more of their respective properties and thus enable different fabric characteristics to be specified at different adhesive zones.

Abstract: Techniques for a touch input device in a circuit board are described. In at least some embodiments, a touch input device is integrated into a circuit board of an apparatus. For instance, a touch interaction region of the touch input device is formed by cutting and/or etching a portion of the circuit board such that the touch interaction region is moveable with respect to adjacent portions of the circuit board. According to one or more embodiments, a touch input device includes a switch such that movement of the touch interaction region actuates the switch to generate a click input event.

Abstract: Texture and graphic formation techniques are described. In one or more implementations, an apparatus includes one or more modules implemented at least partially in hardware, the one or more modules configured to perform operations as part of a computing device. The apparatus also includes an outer layer disposed over and at least partially covering the one or more modules, the outer layer includes a graphics substrate having an outer surface that has a non-smooth texture and one or more graphics formed on an opposing side of the graphics substrate from the outer surface.

Abstract: Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.