Abstract: A heat sink is constructed from a plurality of fin elements each of which has upper and lower heat dissipating surfaces. The upper surface is provided with a centrally located nesting recess while the lower surface is provided with a centrally located nesting shoulder which is complementary in shape to the recess. The fin elements are assembled in interfitting stacked relation such that the nesting shoulder of one fin element is received in nested relation within the recess of an adjacent fin element and further assembled such that the outer side and bottom walls of the shoulder are in intimate facing thermal contact with the inner side and bottom walls of the recess. The side walls of the shoulder and recess of consecutively nested fin elements are consecutively longer in length, i.e. the recess is deeper and shoulder higher, so that the heat dissipating surfaces of the adjacent fin elements are maintained in spaced relation.

Abstract: A folded heat conducting member heatsink includes a base portion and a folded heat conducting member secured into engagement with the base portion with one or more folded heat conducting member securing element, such as annealed metal inserts. The folded heat conducting member includes at least first and second heat conducting portions, such as fins, extending from a fold portion engaged with one or more grooves in the base portion. The securing element or insert is swaged or deformed to force the heat conducting portions into engagement with the groove of the base portion. The method of making the heat sink includes: inserting one or more securing elements, between the heat conducting portions; inserting the heat conducting portions into the groove of the base portion; and applying pressure to the securing elements, such as with an impacting die, to swage or deform the securing elements. The base portion and heat conducting portions of the folded heat conducting member are made of a heat conductive material.

Abstract: A stress-free heatsink assembly and method of manufacturing the same with wire elements embedded into a cured, flexible support element without a rigid base is provided. The heads of the wire elements are embedded in the support element with the enlarged contact surface being in close proximity to and coplanar with the lower surface of the support element. The heatsink assembly adapts to the contour and surface of the heat source as the heat source thermally expands and contracts. Each of the wire elements move independently of one another to adapt to the changing heat source surface to ensure excellent contact of the heat dissipating wire elements to the surface of the heat source at all times. In the manufacture of the stress-free heatsink assembly, the wire elements are introduced into a die member with the heads exposed, a curable media is then placed on top of the heads of the wire elements. A pressure plate provides force to curable media to extrude out excess media on the heads.

Abstract: A multiple pin heatsink device with U-shaped wire elements mechanically swaged into channels of a base element is provided. In the manufacture of the multiple pin heatsink, pins of the U-shaped wire element are introduced into respective pin receiving holes present in the upper surface of a die member to expose the central portion of each wire element. A base element with channels that match the arrangement of the wire elements in the die member is applied with pressure to the exposed central portions of the wire elements to effectively swage and expand the central portions of the wire elements into the corresponding matching channels in the base member for permanent attachment of the wire elements to the base element.

Abstract: An aluminum base alloy suitable for forming into a wrought product having improved combinations of strength and fracture toughness is provided. The alloy is comprised of 0.2 to 5.0 wt. % Li, 0.05 to 6.0 wt. % Mg, 0.2 to 5.0 wt. % Cu, 0 to 2.0 wt. % Mn, 0 to 1.0 wt. % Zr, 0.05 to 12.0 wt. % Zn, 0.05 to 1.0 wt. % Hf, 0.5 wt. % max. Fe, 0.5 wt. % max. Si, the balance aluminum and incidental impurities.