Patents by Inventor John James Hannah McMorran

John James Hannah McMorran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced pad design for substrate
    Patent number: 6940168
    Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: September 6, 2005
    Assignee: International Business Machines Corporation
    Inventors: John Joseph Garrity, John James Hannah McMorran
  • Enhanced pad design for substrate
    Patent number: 6720665
    Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: April 13, 2004
    Assignee: International Business Machines Corporation
    Inventors: John Joseph Garrity, John James Hannah McMorran
  • Enhanced pad design for substrate
    Publication number: 20010010321
    Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.
    Type: Application
    Filed: March 12, 2001
    Publication date: August 2, 2001
    Inventors: John Joseph Garrity, John James Hannah McMorran
  • Enhanced pad design for substrate
    Publication number: 20010001508
    Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.
    Type: Application
    Filed: January 9, 2001
    Publication date: May 24, 2001
    Inventors: John Joseph Garrity, John James Hannah McMorran
  • Enhanced pad design for substrate
    Patent number: 6199741
    Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.
    Type: Grant
    Filed: December 1, 1999
    Date of Patent: March 13, 2001
    Assignee: International Business Machines Corporation
    Inventors: John Joseph Garrity, John James Hannah McMorran