Patents by Inventor John James Horsting
John James Horsting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7521648Abstract: Preferred embodiments of a system and methods to deliver different magnitudes of laser power density to a work piece while maintaining a constant focusing spot size are described. In particular, the system includes a laser, an optical focusing assembly and an overlay. The overlay receives a laser beam having a perimeter at a first magnitude of power and transmits the laser beam to the optical focusing assembly at about the same perimeter and at a magnitude lower than the first magnitude. In a preferred embodiment, the overlay can include an optically neutral blocking lens or a neutral density filter. A method of laser machining an orifice at a suitable average power density sufficient to machine the orifice with reduced heat affected zone, spatters, soots or recasts is described. A method of providing a focusing spot size of a generally constant effective area by a laser machining system is also described.Type: GrantFiled: November 12, 2004Date of Patent: April 21, 2009Assignee: Continental Automotive Systems US, Inc.Inventor: John James Horsting
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Patent number: 7161113Abstract: A laser machining system is provided that includes a work-piece and at least one light source that produces a laser light along a first axis. The laser light defines a first portion of laser light and a second portion of laser light radially inward relative to the first portion. An optical element reflects the first portion of laser light at an angle relative to the first axis so that the second portion of laser light passes through the optical element along the first axis. A first optical assembly collimates the first portion of laser light into a first cross-sectional area on the work-piece at a sufficient power density to machine the work-piece.Type: GrantFiled: May 7, 2004Date of Patent: January 9, 2007Assignee: Siemens VDO Automotive CorporationInventor: John James Horsting
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Patent number: 6930274Abstract: Preferred embodiments of a system and methods to deliver different magnitudes of laser power density to a work piece while maintaining a constant focusing spot size are described. In particular, the system includes a laser, an optical focusing assembly and an overlay. The overlay receives a laser beam having a perimeter at a first magnitude of power and transmits the laser beam to the optical focusing assembly at about the same perimeter and at a magnitude lower than the first magnitude. In a preferred embodiment, the overlay can include an optically neutral blocking lens or a neutral density filter. A method of laser machining an orifice at a suitable average power density sufficient to machine the orifice with reduced heat affected zone, spatters, soots or recasts is described. A method of providing a focusing spot size of a generally constant effective area by a laser machining system is also described.Type: GrantFiled: March 26, 2003Date of Patent: August 16, 2005Assignee: Siemens VDO Automotive CorporationInventor: John James Horsting
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Publication number: 20040206734Abstract: A laser machining system is provided that includes a work-piece and at least one light source that produces a laser light along a first axis. The laser light defines a first portion of laser light and a second portion of laser light radially inward relative to the first portion. An optical element reflects the first portion of laser light at an angle relative to the first axis so that the second portion of laser light passes through the optical element along the first axis. A first optical assembly collimates the first portion of laser light into a first cross-sectional area on the work-piece at a sufficient power density to machine the work-piece.Type: ApplicationFiled: May 7, 2004Publication date: October 21, 2004Applicant: Siemens VDO Automotive CorporationInventor: John James Horsting
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Publication number: 20040188402Abstract: Preferred embodiments of a system and methods to deliver different magnitudes of laser power density to a work piece while maintaining a constant focusing spot size are described. In particular, the system includes a laser, an optical focusing assembly and an overlay. The overlay receives a laser beam having a perimeter at a first magnitude of power and transmits the laser beam to the optical focusing assembly at about the same perimeter and at a magnitude lower than the first magnitude. In a preferred embodiment, the overlay can include an optically neutral blocking lens or a neutral density filter. A method of laser machining an orifice at a suitable average power density sufficient to machine the orifice with reduced heat affected zone, spatters, soots or recasts is described. A method of providing a focusing spot size of a generally constant effective area by a laser machining system is also described.Type: ApplicationFiled: March 26, 2003Publication date: September 30, 2004Applicant: Siemens VDO Automotive CorporationInventor: John James Horsting
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Patent number: 6740847Abstract: A method and apparatus for forming a plurality of orifices in a work piece with a single laser at a rated power density that provides two independent laser machining spots with each laser machining spot having nearly the same power density as the rated power density of the single laser.Type: GrantFiled: March 10, 2003Date of Patent: May 25, 2004Assignee: Siemens VDO Automotive CorporationInventor: John James Horsting
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Patent number: 6720526Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval during the first time interval. The apparatus includes at least one source of collimated and non-collimated light, various spatial filters that can be used with the laser light source, a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.Type: GrantFiled: October 9, 2001Date of Patent: April 13, 2004Assignee: Siemens Automotive CorporationInventors: John James Horsting, Christoph Hamann
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Patent number: 6635847Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of non-collimated light at a second time interval during the first time interval. The apparatus includes at least one source of collimated and non-collimated light, a collimated light filter, and a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.05 microns and approximately 0.Type: GrantFiled: July 31, 2001Date of Patent: October 21, 2003Assignee: Siemens Automotive CorporationInventor: John James Horsting
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Patent number: 6600132Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval simultaneously with the first time interval. The apparatus includes at least a source of collimated and non-collimated light, a collimated light filter, and a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.Type: GrantFiled: July 31, 2001Date of Patent: July 29, 2003Inventors: John James Horsting, Mool Chand Gupta
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Publication number: 20030024906Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval during the first time interval. The apparatus includes at least one source of collimated and non-collimated light, various spatial filters that can be used with the laser light source, a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.Type: ApplicationFiled: October 9, 2001Publication date: February 6, 2003Applicant: Siemens Automotive CorporationInventors: John James Horsting, Christoph Hamann
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Publication number: 20030024910Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval during the first time interval. The apparatus includes at least one source of collimated and non-collimated light, a collimated light filter, and a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.05 micron and approximately 0.Type: ApplicationFiled: July 31, 2001Publication date: February 6, 2003Applicant: Siemens Automotive CorporationInventor: John James Horsting
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Publication number: 20030024911Abstract: A method of and apparatus for forming chamfers in an orifice of a workpiece. The orifice has an axis, which extends between a first surface and second surface of the workpiece, where the first and second surfaces are parallel to each other. The chamfers are disposed between the first surface and the second surface. The method includes forming an orifice in a workpiece with a source of non-collimated light directed at the workpiece at a predetermined first time interval, and forming a chamfer with a source of collimated light at a second time interval simultaneously with the first time interval. The apparatus includes at least a source of collimated and non-collimated light, a collimated light filter, and a non-collimated light generating arrangement, and at least one shutter and at least one iris that direct collimated and non-collimated light at the workpiece to form the orifice. The apparatus is configured such that the orifice has a surface roughness of between approximately 0.Type: ApplicationFiled: July 31, 2001Publication date: February 6, 2003Applicant: Siemens Automotive CorporationInventors: John James Horsting, Mool Chand Gupta