Abstract: A method of making a multi-chip module by thinning individual integrated circuit die or an integrated circuit wafer containing multiple integrated circuits; bonding thinned dice or a thinned wafer to a mylar, polyimide, semiconductor, or ceramic substrate; depositing at least one interconnect material over the wafer, where the first interconnect layer is deposited directly over the wafer; depositing a dielectric layer over each of the interconnect layers; opening vias in the dielectric layers in order to interconnect the dice and multi-chip module as required; and removing the substrate to form a thin, conformal, and high-yielding multi-chip module.