Abstract: A method for depositing coating onto a substrate includes providing a monomer for creation of a protective coating on a substrate, energizing the monomer with a plasma generation system, and polymerizing the energized monomer onto the substrate in a plasma-enhanced chemical vapor deposition (PECVD) chamber.

Abstract: A method for depositing coating onto a substrate includes providing a monomer for creation of a protective coating on a substrate, energizing the monomer with a plasma generation system, and polymerizing the energized monomer onto the substrate in a plasma-enhanced chemical vapor deposition (PECVD) chamber.

Abstract: A method for depositing coating onto a substrate includes providing a monomer for creation of a protective coating on a substrate, energizing the monomer with a plasma generation system, and polymerizing the energized monomer onto the substrate in a plasma-enhanced chemical vapor deposition (PECVD) chamber.

Abstract: A deposition system includes a multipurpose deposition chamber, a pre-treatment source and a post-treatment source. The multipurpose deposition chamber is configured to deposit parylene on a plurality of electronic devices. The multipurpose deposition chamber is configured to process pre-treatment of the plurality of electronic devices prior to deposition of the parylene. The multipurpose deposition chamber is configured to process post-treatment of the plurality of electronic devices after deposition of the parylene.

Abstract: A laser ablation system includes a laser configured to irradiate or sublimate a portion of a thin-film coating located on an electronic device, a controller for controlling the laser, and an optical system comprising one or more optical sensors configured to detect the electronic component and a location of the portion of the thin-film coating to be irradiated or sublimated.

Abstract: A method of assembling an implantable electrode array from a coupon (108) formed from plastically deformable material. Layers of material are disposed on the coupon to form the electrodes (48) and conductors (62) of one or more electrode arrays. Sections of the coupon on which the electrodes and conductors are removed, along with the electrodes and conductors to form the electrode arrays. The removed sections of the coupon thus function as plastically deformable carriers (74) for the arrays (40).

Abstract: Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction are selectively applied to the coupon to ensure that it has a consistent height across its exposed surface. Once the polymer coupon is bonded the components forming the medical device are attached to the coupon and the coupon is shaped to form the individual medical devices. Shaped sections of the coupon are then lifted off the rigid backing. The lifted off sections on which the components were attached are the medical devices.

Abstract: A system for plasma etching or ashing a coating on a substrate includes a plasma chamber, a second electrode, a plasma source coupled to the plasma chamber, a substrate including a coating, and a plasma mask including at least one aperture. The plasma chamber includes a first electrode. The plasma mask is configured to cover the substrate while exposing selected surfaces of the substrate and coating through the at least one aperture. The first electrode and the second electrode are configured to initiate and maintain a plasma within the plasma chamber. The plasma source includes a gas.

Abstract: An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.

Abstract: A method of forming an implantable electrode array that includes one or more packaged control modules. A control module is packaged by mounting the module to a substrate and forming a containment ring around the module. A conformal coating is disposed over the surface of the module to cover the carrier. Within the containment ring, the conformal coating hardens to form a non-porous shell around the control module. The one or more packaged control modules are placed in a flexible array. Electrodes that are mounted to or embedded in the flexible carrier are connected to the one or more control modules.

Abstract: A method of forming an implantable electrode array that includes one or more packaged control modules. A control module is packaged by mounting the module to a substrate and forming a containment ring around the module. A conformal coating is disposed over the surface of the module to cover the carrier. Within the containment ring, the conformal coating hardens to form a non-porous shell around the control module. The one or more packaged control modules are placed in a flexible array. Electrodes that are mounted to or embedded in the flexible carrier are connected to the one or more control modules.

Abstract: Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction are selectively applied to the coupon to ensure that it has a consistent height across its exposed surface. Once the polymer coupon is bonded the components forming the medical device are attached to the coupon and the coupon is shaped to form the individual medical devices. Shaped sections of the coupon are then lifted off the rigid backing. The lifted off sections on which the components were attached are the medical devices.

Abstract: An implantable electrode array that includes a carrier on which multiple spaced apart electrodes are disposed. Embedded in the module are control modules. The control modules are contained in packages. Portions of the packages extend outwardly from the carrier so as to be disposed against adjacent surfaces of the carrier. The packages contain conductive tracts that provide conductive links from the conductors internal to the carrier to the packaged control modules.

Abstract: A pair of phase shifted polygon primary windings, each of which are magnetically coupled to one of a pair of forked wye output windings providing a phase shifted pseudo multiple pulse output voltage waveform from the secondary output windings.

Abstract: Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction are selectively applied to the coupon to ensure that it has a consistent height across its exposed surface. Once the polymer coupon is bonded the components forming the medical device are attached to the coupon and the coupon is shaped to form the individual medical devices. Shaped sections of the coupon are then lifted off the rigid backing. The lifted off sections on which the components were attached are the medical devices.

Abstract: A method for pumping water on a naval vessel is disclosed, the method including but not limited to pumping fresh water from a fresh water reservoir into a fresh water flush tank; pumping salt water from a salt water reservoir into a fire water reservoir during fire operations; controlling a valve in liquid communication to alternately connect the fire water reservoir to the salt water reservoir to supply salt water to the fire water reservoir during fire operations and connecting the fire water reservoir to the fresh water flush to flush salt water from the fire water reservoir after fire water operations. A system is disclosed for practicing the method.

Abstract: A method of assembling an implantable electrode array from a coupon (108) formed from plastically deformable material. Layers of material are disposed on the coupon to form the electrodes (48) and conductors (62) of one or more electrode arrays. Sections of the coupon on which the electrodes and conductors are removed, along with the electrodes and conductors to form the electrode arrays. The removed sections of the coupon thus function as plastically deformable carriers (74) for the arrays (40).

Abstract: A method for pumping water on a naval vessel is disclosed, the method including but not limited to pumping fresh water from a fresh water reservoir into a fresh water flush tank; pumping salt water from a salt water reservoir into a fire water reservoir during fire operations; controlling a valve in liquid communication to alternately connect the fire water reservoir to the salt water reservoir to supply salt water to the fire water reservoir during fire operations and connecting the fire water reservoir to the fresh water flush to flush salt water from the fire water reservoir after fire water operations. A system is disclosed for practicing the method.

Abstract: Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction are selectively applied to the coupon to ensure that it has a consistent height across its exposed surface. Once the polymer coupon is bonded the components forming the medical device are attached to the coupon and the coupon is shaped to form the individual medical devices. Shaped sections of the coupon are then lifted off the rigid backing. The lifted off sections on which the components were attached are the medical devices.

Abstract: An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After each coupon is shaped or components mounted to the coupon, the coupons are bonded together. The adhesive is dissolved to remove the device from the backing or backings to which it is attached.