Patents by Inventor John Jay Maloney

John Jay Maloney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heatplates for heatsink attachment for semiconductor chips
    Patent number: 7834444
    Abstract: An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: November 16, 2010
    Assignee: International Business Machines Corporation
    Inventors: Elie Awad, John Jay Maloney
  • HEATPLATES FOR HEATSINK ATTACHMENT FOR SEMICONDUCTOR CHIPS
    Publication number: 20090200660
    Abstract: An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.
    Type: Application
    Filed: February 26, 2009
    Publication date: August 13, 2009
    Inventors: Elie Awad, John Jay Maloney
  • Heatplates for heatsink attachment for semiconductor chips
    Patent number: 7498673
    Abstract: An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: March 3, 2009
    Assignee: International Business Machines Corporation
    Inventors: Elie Awad, John Jay Maloney
  • Heatplates for heatsink attachment for semiconductor chips
    Publication number: 20080116570
    Abstract: An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.
    Type: Application
    Filed: November 21, 2006
    Publication date: May 22, 2008
    Applicant: International Business Machines Corporation
    Inventors: Elie Awad, John Jay Maloney