Patents by Inventor John Joseph Salazar
John Joseph Salazar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9916480Abstract: According to an example, a security apparatus to house a device may include a chassis, a front stop having a front stop wall and a front stop opening, a rear stop having a rear stop wall and a rear stop opening, a front cover to be positioned in front of the front stop having a front cover opening, in which the front stop wall blocks direct line of sight into the front opening of the chassis through the front cover opening when the front cover is positioned in front of the front stop, and a rear cover to be positioned behind the rear stop having a rear cover opening, in which the rear cover blocks direct line of sight into the rear opening of the chassis through the rear cover opening when the rear cover is positioned behind the rear stop wall.Type: GrantFiled: May 30, 2013Date of Patent: March 13, 2018Assignee: Trend Micro IncorporatedInventors: Paul A Tucker, John Joseph Salazar
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Publication number: 20160125206Abstract: According to an example, a security apparatus to house a device may include a chassis, a front stop having a front stop wall and a front stop opening, a rear stop having a rear stop wall and a rear stop opening, a front cover to be positioned in front of the front stop having a front cover opening, in which the front stop wall blocks direct line of sight into the front opening of the chassis through the front cover opening when the front cover is positioned in front of the front stop, and a rear cover to be positioned behind the rear stop having a rear cover opening, in which the rear cover blocks direct line of sight into the rear opening of the chassis through the rear cover opening when the rear cover is positioned behind the rear stop wall.Type: ApplicationFiled: May 30, 2013Publication date: May 5, 2016Inventors: Paul A. Tucker, John Joseph Salazar
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Patent number: 7479796Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: January 20, 2009Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7466155Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: December 16, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7463017Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: December 9, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7456644Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: November 25, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7453279Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: November 18, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7425822Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: September 16, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7423440Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: September 9, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7405583Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: July 29, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7352200Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: January 12, 2005Date of Patent: April 1, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 6911836Abstract: A chip testing system with improved thermal performance. In a preferred embodiment, a nest assembly of a chip testing apparatus includes tooling balls and a fitted frame for improving alignment of a coldplate and a chip surface. In preferred embodiments, the coldplate is of unibody design. Thermal performance is also improved by balancing the forces exerted on the coldplate using an adjustable hose mounting bracket. The bracket allows the forces exerted by the hoses on the coldplate to be adjusted so they balance and cancel other unwanted forces on the cold plate.Type: GrantFiled: August 21, 2003Date of Patent: June 28, 2005Assignee: International Business Machines CorporationInventors: Lonnie J. Cannon, John Saunders Corbin, Jr., David Lewis Gardell, Jose Arturo Garza, Jeffrey Frank Kutner, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., John Joseph Salazar