Abstract: A method and computer program product for determining an internal temperature of a computing device, a power consumption factor for the computing device, and an airflow factor for the computing device. An approximated ambient air temperature is generated based upon the internal temperature, power consumption factor, and the airflow factor. A workload factor is determined for the computing device and a fan speed for the computing device is controlled based at least in part upon the approximated ambient air temperature and the workload factor.

Abstract: A power measurement transducer includes a first surface configured to thermally couple the power measurement transducer to a device under test. A second surface is essentially parallel to and spaced apart from the first surface. Two or more temperature measurement elements are positioned between the first and second surfaces. The power measurement transducer is configured to allow at least a portion of the power generated within the device under test to enter the power measurement transducer through the first surface and exit the power measurement transducer through the second surface.

Abstract: A method of determining thermal output of a device under test includes attaching a power measurement transducer to a device under test, wherein the power measurement transducer includes two or more temperature measurement elements. A test sequence is applied to the device under test. One or more signals produced by the power measurement transducer are monitored to determine a quantity of power produced by the device under test during the test sequence.

Abstract: A power measurement transducer includes a thermally conductive heat spreading device having a first surface configured to thermally couple the power measurement transducer to a device under test. Two or more temperature measurement elements are positioned within the thermally conductive heat spreading device.

Abstract: A cooling system includes an evaporator assembly configured to thermally contact one or more memory modules and absorb thermal energy from the one or more memory modules. A condenser assembly is thermally coupled to the evaporative assembly and configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporative assembly.

Abstract: A method and computer program product for determining an internal temperature of a computing device, a power consumption factor for the computing device, and an airflow factor for the computing device. An approximated ambient air temperature is generated based upon the internal temperature, power consumption factor, and the airflow factor.

Abstract: A cabinet having a pair of vertically stacked chassis separated by a central, vertically extending region. A pair of laterally spaced, vertically extending panels is disposed in the central region, the panels forming: a pair of outer compartments for receiving air exiting a corresponding one of the pair of laterally spaced vertically stacked chassis; and an inner compartment for receiving air exiting the pair of vertically stacked chassis. The panels have therein an array of openings in a lower portion thereof for passing portions of air in the outer compartments into the inner compartment. An upper portion of the panels inhibits portions of air in the outer compartments from passing into the inner compartment. The openings extend in rows horizontally across the panel. The number of opening in lower ones of the rows is greater than the number of opening in upper ones of the rows.

Abstract: A heatsink assembly includes a rigid thermally conductive block having a relatively flat unobstructed surface area and a plurality of legs extending beyond and straddling that surface area, and a thermally conductive compliant pad positioned against the surface area. The assembly is adapted to be positioned over a chip package on a circuit board so that the block covers the package and the pad deforms initially to conform to the abutting surface of the package to establish intimate thermal contact between the package and the block. Suitable fasteners secure the block to the circuit board.

Abstract: An air-cooled self-contained evaporator and condenser apparatus with no external power source, the apparatus including a cold plate having a first surface with recesses formed therein in a matrix or array corresponding to the matrix or array of chips on a multi-chip module or unit. The opposite surface of the cold plate includes a finned arrangement which, in conjunction with the cold plate, forms part of an isolated evaporation chamber of the cooling unit, with the chamber housing a boilable fluid which changes phase from liquid to vapor. Positioned above and contiguous with the isolated chamber is a condensing chamber, including a plurality of tubular passageways, the external portions of which are finned for ready removal of heat. For attachment of the cold plate portion of the unit to the chips, suitable heat transfer slugs, such as aluminum nitride slugs, are affixed in the recesses, with opposites surfaces thereof bonded to the exposed faces of the chips.

Abstract: A device for preventing the back flow of water from a point of use into a water supply line. The device includes a unitary casing having an inlet, a central chamber, an outlet, a removal port and a drain vent opening. The inlet, the central chamber and the outlet are coaxially aligned. A relief valve is located in the central chamber and offset from the coaxial alignment of the inlet, the central chamber and the outlet. There is a cover for the removal port. There is also a pair of check valves. One is mounted between the inlet and the central chamber and the other is mounted between the outlet and the central chamber. The device allows water to pass unobstructed in a straight-through flow path through the device. The back flow of water is prevented.

Abstract: An air vent device for automatically venting entrapped air from hot water heating and chilled water cooling systems. The device can vent a large volume of air in a relatively short time by using a large vent opening, controlled by a pilot valve operated diaphragm venting valve. The pilot valve, actuated by a spring and connected to a float, permits air pressure within the device to pass to the rear of the diaphragm valve to maintain it in a closed position during normal operation of the system. When the float drops to a predetermined position the float weight overcomes the spring force and the pilot valve vents the rear side of the diaphragm valve to atmosphere, allowing it to open, thereby venting the air collected in the device to atmosphere.

Abstract: A back flow preventing device is disclosed which prevents the reverse flow of water from a point of use into a water supply system. The device has a casing with coaxially aligned inlet and outlet openings, and containing coaxially aligned inlet and outlet check valves. The coaxial alignment of the inlet and outlet openings, and of the inlet and outlet check valves serves to minimize the pressure drop through the device. Between the inlet and outlet check valves is a diaphragm actuated relief valve which opens to drain the passage between the check valves if they should malfunction or if there is a drop in the supply line pressure sufficient to cause actual or potential reverse flow back toward the supply line. The internally-located inlet and outlet check valves are each removably secured in place by internally-located retaining rings.

Abstract: A back flow preventing device which prevents the reverse flow of water from a point of use into a water supply system. The device has a casting with coaxially aligned inlet and outlet openings, and containing coaxially aligned inlet and outlet check valves. The coaxial alignment of the inlet and outlet openings, and of the inlet and outlet check valves serves to minimize the pressure drop through the device. Between the inlet and outlet check valves is a diaphragm actuated relief valve which opens to drain the passage between the check valves if they should malfunction or if there is a drop in the supply line pressure sufficient to cause actual or potential reverse flow back toward the supply line.

Abstract: A back flow preventer for preventing contamination of a water supply. The preventer includes check valves which are enclosed in a casing comprised of a body and a single removable cover. The check valves are vertically disposed and spaced laterally from each other. The valves may be removed for servicing when the cover is removed without disturbing other parts of the device. Between the check valves is a relief valve which opens to drain the passage between the check valves when there is a drop in the supply line pressure sufficient to cause actual or potential reverse flow back toward the supply line. The check valves open by movement in opposite directions. Each check valve unit includes a tubular strainer through which all water must pass. The check valve units, while identically dimensioned as to the valve structure, include other parts of unequal dimensions which preclude accidental reversal of the units when being initially assembled or replaced after servicing.