Patents by Inventor John K. Lim

John K. Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic Resin for Compression Molding
    Publication number: 20240067821
    Abstract: Compounded thermoplastic resin, molding composition, compounded polyamide composition, articles formed from the same, and methods of making the resins/compositions and articles. A compounded thermoplastic resin includes a polyamide composition and a random copolymer composition.
    Type: Application
    Filed: December 16, 2021
    Publication date: February 29, 2024
    Inventors: John Buzinkai, Peng He, Isaac K. Iverson, Charles Richard Langrick, Chee Sern Lim
  • Preparation of a coated metal-matrix composite material
    Patent number: 5706999
    Abstract: A composite material of silicon carbide particles in an aluminum matrix is base coated with a layer of a nickel-boron alloy by an electroless process. The base-coated composite material is heat treated at a temperature of about 450.degree. C. to interdiffuse the base coating with the composite material. A nickel or gold top layer is electrolytically deposited over the base coat on the heat-treated composite material.
    Type: Grant
    Filed: November 28, 1995
    Date of Patent: January 13, 1998
    Assignee: Hughes Electronics
    Inventors: John K. Lim, Joseph S. Russo