Abstract: A tablet computing system may include a housing member defining a first portion of a back exterior surface of the tablet computer, at least a portion of a side exterior surface of the tablet computer, a raised rim extending from the back exterior surface and at least partially defining a sensor assembly hole extending through the housing member, and a support ledge positioned in the sensor assembly hole. The tablet computing system may also include a frame member positioned at least partially in the sensor assembly hole and coupled to the support ledge, a camera bracket coupled to the frame member, a first camera module coupled to the camera bracket, aa second camera module coupled to the camera bracket, the camera bracket fixing the relative positions of the first camera module and the second camera module, and a cover member positioned in the sensor assembly hole and attached to the frame member.

Abstract: A tablet computing system may include a housing member defining a first portion of a back exterior surface of the tablet computer, at least a portion of a side exterior surface of the tablet computer, a raised rim extending from the back exterior surface and at least partially defining a sensor assembly hole extending through the housing member, and a support ledge positioned in the sensor assembly hole. The tablet computing system may also include a frame member positioned at least partially in the sensor assembly hole and coupled to the support ledge, a camera bracket coupled to the frame member, a first camera module coupled to the camera bracket, aa second camera module coupled to the camera bracket, the camera bracket fixing the relative positions of the first camera module and the second camera module, and a cover member positioned in the sensor assembly hole and attached to the frame member.

Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.

Abstract: A tablet computing system may include a housing member defining a first portion of a back exterior surface of the tablet computer, at least a portion of a side exterior surface of the tablet computer, a raised rim extending from the back exterior surface and at least partially defining a sensor assembly hole extending through the housing member, and a support ledge positioned in the sensor assembly hole. The tablet computing system may also include a frame member positioned at least partially in the sensor assembly hole and coupled to the support ledge, a camera bracket coupled to the frame member, a first camera module coupled to the camera bracket, aa second camera module coupled to the camera bracket, the camera bracket fixing the relative positions of the first camera module and the second camera module, and a cover member positioned in the sensor assembly hole and attached to the frame member.

Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.