Patents by Inventor John Kelbert

John Kelbert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12253901
    Abstract: Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Nikos Kaburlasos, Rodrigo De Oliveira Vivi, Phani Kumar Kandula, Marc Beuchat, Mark J. Luckeroth, Eric J. M. Moret, David N. Lombard, John Kelbert, Brad Bittel
  • Patent number: 12135569
    Abstract: Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: November 5, 2024
    Assignee: INTEL CORPORATION
    Inventors: Rodrigo De Oliveira Vivi, John Kelbert, David Lombard, Eric Moret, Mark Luckeroth, Brad Bittel, Phani Kumar Kandula
  • Publication number: 20230101997
    Abstract: Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.
    Type: Application
    Filed: September 30, 2021
    Publication date: March 30, 2023
    Inventors: Nikos Kaburlasos, Rodrigo De Oliveira Vivi, Phani Kumar Kandula, Marc Beuchat, Mark J. Luckeroth, Eric J.M. Moret, David N. Lombard, John Kelbert, Brad Bittel
  • Publication number: 20210223805
    Abstract: Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.
    Type: Application
    Filed: December 23, 2020
    Publication date: July 22, 2021
    Inventors: Rodrigo De Oliveira Vivi, John Kelbert, David Lombard, Eric Moret, Mark Luckeroth, Brad Bittel, Phani Kumar Kandula