Patents by Inventor John Krawczyk

John Krawczyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7862065
    Abstract: An adjustable length bicycle mountable hand pump. The pump includes a barrel having an internal cylinder within which a piston is reciprocatingly moveable. A piston rod connects to a piston at a proximal end and to a handle at a distal end. The handle is selectively, longitudinally, adjustably lockable relative to the barrel. The end of the handle is contoured to mate with a bicycle frame member. A head having a contoured portion mates with an opposing spaced bicycle frame member.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: January 4, 2011
    Assignee: Bicycle Tools Incorporated
    Inventors: Eric Hawkins, Pierre A. G. Ostor, John Krawczyk
  • Publication number: 20090060766
    Abstract: An adjustable length bicycle mountable hand pump. The pump includes a barrel having an internal cylinder within which a piston is reciprocatingly moveable. A piston rod connects to a piston at a proximal end and to a handle at a distal end. The handle is selectively, longitudinally, adjustably lockable relative to the barrel. The end of the handle is contoured to mate with a bicycle frame member. A head having a contoured portion mates with an opposing spaced bicycle frame member.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 5, 2009
    Applicant: Bicycle Tools Incorporated, d/b/a Park Tool Co.
    Inventors: Eric Hawkins, Pierre A.G. Ostor, John Krawczyk
  • Publication number: 20080029562
    Abstract: A portable backpack workstation for holding tools and the like. The backpack includes a self-supporting rigid frame and a shell defining a body having a top, a bottom, a back and left and right wing panels. The left and right wing panels are movable between an open position and a closed position. A pair of shoulder straps are secured to the back of the body.
    Type: Application
    Filed: July 31, 2007
    Publication date: February 7, 2008
    Applicant: Bicycle Tools Incorporated d/b/a Park Tool Co.
    Inventors: Eric Hawkins, Pierre A. G. Ostor, John Krawczyk
  • Publication number: 20070257006
    Abstract: A method of micro-machining a semiconductor substrate to form one or more through slots therein. The semiconductor substrate has a device side and a fluid side opposite the device side. The method includes diffusing a p-type doping material into the device side of the semiconductor substrate in one or more through slot locations to be etched through a thickness of the substrates. The semiconductor substrate is then etched with a dry etch process from the device side of the substrate to the fluid side of the substrate so that one or more through slots having a reentrant profile are formed in the substrate.
    Type: Application
    Filed: July 17, 2007
    Publication date: November 8, 2007
    Inventors: David BERNARD, John Krawczyk, Andrew McNees
  • Publication number: 20070259292
    Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.
    Type: Application
    Filed: July 19, 2007
    Publication date: November 8, 2007
    Inventors: John Krawczyk, James Mrvos, Girish Patil, Jason Vanderpool, Brian Hart, Christopher Money, Jeanne Singh, Karthik Vaideeswaran
  • Publication number: 20070229594
    Abstract: Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
    Type: Application
    Filed: November 3, 2006
    Publication date: October 4, 2007
    Applicant: LEXMARK INTERNATIONAL, INC.
    Inventors: David Graham, Brian Hart, Gary Holt, John Krawczyk, Sean Weaver, Mary Smoot
  • Publication number: 20070000863
    Abstract: A method of micro-machining a semiconductor substrate to form one or more through slots therein. The semiconductor substrate has a device side and a fluid side opposite the device side. The method includes diffusing a p-type doping material into the device side of the semiconductor substrate in one or more through slot locations to be etched through a thickness of the substrate. The semiconductor substrate is then etched with a dry etch process from the device side of the substrate to the fluid side of the substrate so that one or more through slots having a reentrant profile are formed in the substrate.
    Type: Application
    Filed: June 30, 2005
    Publication date: January 4, 2007
    Inventors: David Bernard, John Krawczyk, Andrew McNees
  • Publication number: 20060189144
    Abstract: A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (hereinafter “slots”) in the substrates. The process includes applying a first layer to a back side of a substrate as a first etch stop material. The first layer is a relatively soft etch stop material. A second layer is applied to the first layer on the back side of the substrate to provide a composite etch stop layer. The second layer is a relatively hard etch stop material. The substrate is etched from a side opposite the back side of the substrate to provide a slot in the substrate.
    Type: Application
    Filed: February 22, 2005
    Publication date: August 24, 2006
    Inventors: John Krawczyk, Andrew McNees, Christopher Money, Girish Patil, David Rhine, Karthik Vaideeswaran
  • Publication number: 20060115921
    Abstract: Methods of micro-machining a semiconductor substrate to form through fluid feed slots therein. One method includes providing a semiconductor substrate wafer having a thickness greater than about 500 microns and having a device side and a back side opposite the device side. The back side of the wafer is mechanically ground to provide a wafer having a thickness ranging from about 100 up to about 500 microns. Dry etching is conducted on the wafer from a device side thereof to form a plurality of reentrant fluid feed slots in the wafer from the device side to the back side of the wafer.
    Type: Application
    Filed: December 1, 2004
    Publication date: June 1, 2006
    Inventors: John Krawczyk, Andrew McNees, Richard Warner
  • Publication number: 20060113277
    Abstract: A method of micro-machining a semiconductor substrate to form through slots therein and substrates made by the method. The method includes providing a dry etching chamber having a platen for holding a semiconductor substrate. During an etching cycle of a dry etch process for the semiconductor substrate, a source power is decreased, a chamber pressure is decreased from a first pressure to a second pressure, and a platen power is increased from a first power to a second power. Through slots in the substrate provided by the method can have a reentrant profile for fluid flow therethrough.
    Type: Application
    Filed: December 1, 2004
    Publication date: June 1, 2006
    Inventors: John Krawczyk, Andrew McNees, Richard Warner
  • Publication number: 20060077221
    Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.
    Type: Application
    Filed: November 17, 2005
    Publication date: April 13, 2006
    Inventors: Karthik Vaideeswaran, Andrew McNees, John Krawczyk, James Mrvos, Cory Hammond, Mark Doerre, Jason Vanderpool, Girish Patil, Christopher Money, Gary Williams, Richard Warner
  • Publication number: 20060054592
    Abstract: Methods of forming a fluid channel in a semiconductor substrate may include providing a semiconductor substrate having a backside and a device side, wherein the device side is configured to secure ink ejecting devices thereon and applying a material layer to the backside of the semiconductor substrate. The method may further include providing a gray scale mask configured with a pattern corresponding to a fluid channel having a plurality of slots, exposing the material layer to sufficient light radiation energy through the gray scale mask and etching the exposed material layer and the semiconductor substrate through to the device side of the semiconductor substrate.
    Type: Application
    Filed: December 30, 2004
    Publication date: March 16, 2006
    Inventors: John Krawczyk, Andrew McNees, James Mrvos, David Bernard
  • Publication number: 20060054590
    Abstract: A method of substantially simultaneously forming at least two fluid supply slots through a thickness of semiconductor substrate from a first surface to a second surface thereof. The method includes the steps of applying a photoresist layer to the first surface of the semiconductor substrate. The photoresist layer is patterned and developed using a gray scale mask for a first fluid supply slot. The semiconductor substrate is then reactive ion etched, to form the at least two fluid supply slots through the thickness of the substrate. The first fluid supply slot is substantially wider than the second fluid supply slot, and the first and second fluid supply slots are etched through the substrate at substantially the same rate.
    Type: Application
    Filed: September 10, 2004
    Publication date: March 16, 2006
    Inventors: John Krawczyk, Andrew McNees, James Mrvos
  • Publication number: 20060055724
    Abstract: Methods of forming a fluid channel in a semiconductor substrate may include applying a material layer to at least one surface of the semiconductor substrate. The method may further include manipulating the material layer to form a surface topography corresponding to a channel, the surface topography being configured to control directionality of ion bombardment of said substrate along electromagnetic field lines in a plasma sheath coupled to said surface topography.
    Type: Application
    Filed: December 30, 2004
    Publication date: March 16, 2006
    Inventors: John Krawczyk, Andrew McNees
  • Publication number: 20060054591
    Abstract: A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.
    Type: Application
    Filed: September 14, 2004
    Publication date: March 16, 2006
    Inventors: David Bernard, John Krawczyk, Christopher Money, Andrew McNees, Girish Patil, Karthik Vaideeswaran, Richard Warner
  • Publication number: 20050231557
    Abstract: A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.
    Type: Application
    Filed: April 14, 2004
    Publication date: October 20, 2005
    Inventors: John Krawczyk, Andrew McNees, James Mrvos, Carl Sullivan
  • Publication number: 20050205517
    Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.
    Type: Application
    Filed: September 15, 2004
    Publication date: September 22, 2005
    Inventors: John Krawczyk, James Mrvos, Girish Patil, Jason Vanderpool, Brian Hart, Christopher Money, Jeanne Singh, Karthik Vaideeswaran
  • Publication number: 20050193114
    Abstract: A content-aware flow switch intercepts a client content request in an IP network, and transparently directs the content request to a best-fit server. The best-fit server is chosen based on the type of content requested, the quality of service requirements implied by the content request, the degree of load on available servers, network congestion information, and the proximity of the client to available servers. The flow switch detects client-server flows based on the arrival of TCP SYNs and/or HTTP GETs from the client. The flow switch implicitly deduces the quality of service requirements of a flow based on the content of the flow. The flow switch also provides the functionality of multiple physical web servers on a single web server in a way that is transparent to the client, through the use of virtual web hosts and flow pipes.
    Type: Application
    Filed: February 11, 2005
    Publication date: September 1, 2005
    Applicant: Cisco Technology, Inc.
    Inventors: Steven Colby, John Krawczyk, Raj Nair, Katherine Royce, Kenneth Siegel, Richard Stevens, Scott Wasson
  • Publication number: 20050093912
    Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.
    Type: Application
    Filed: November 4, 2003
    Publication date: May 5, 2005
    Inventors: Karthik Vaideeswaran, Andrew McNees, John Krawczyk, James Mrvos, Cory Hammond, Mark Doerre, Jason Vanderpool, Girish Patil, Christopher Money, Gary Williams, Richard Warner
  • Patent number: 6622329
    Abstract: A three-piece bicycle tool assembly consists of a first tool carrier, a second tool carrier, and an engagement member separate from and slidingly engaging the first tool carrier and the second tool carrier. The first tool carrier and the second tool carrier each have a number of tools pivotably engaged thereon. A chain repair tool on the engagement member is held between the first tool carrier and the second tool carrier so that it is not substantially exposed.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: September 23, 2003
    Assignee: Bicycle Tools Incorporated
    Inventors: Pierre Ostor, John Krawczyk