Abstract: A novel midplane is shaped with voids through which a dataplane connection is made between components on one side of the midplane and components on the opposite side of the midplane. The voids in the novel midplane offer numerous advantages in the design of network devices, including improved cooling performance, minimizing rack unit space and maximizing interface density, improved signal integrity allowing greater bandwidth through elimination of midplane signaling connections, improved upgradability of orthogonal direct connectors with little or no impact on the midplane or chassis, and proper alignment between the components of the dataplane.