Patents by Inventor John L. Cordani, Jr.

John L. Cordani, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for improving the adhesion of polymeric materials to metal surfaces
    Patent number: 8088246
    Abstract: An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: January 3, 2012
    Inventors: John L. Cordani, Jr., Kesheng Feng, Steven A. Castaldi, Colleen Mckirryher
  • Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
    Publication number: 20100170638
    Abstract: An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.
    Type: Application
    Filed: January 8, 2009
    Publication date: July 8, 2010
    Inventors: John L. Cordani, JR., Kesheng Feng, Steven A. Castaldi, Colleen Mckirryher
  • Process for improving the adhesion of polymeric materials to metal surfaces
    Patent number: 7704562
    Abstract: A process is disclosed for the purpose of increasing the adhesion of a polymeric material to a metal surface. The process comprises plating the metal surface with a layer of electroless nickel, electroless cobalt or electroless (or immersion) tin followed by phosphating the plated layer prior to bonding the polymeric material thereto. The process is particularly suited to treating printed circuit board inner-layers and lead frames.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: April 27, 2010
    Inventor: John L. Cordani, Jr.