Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: A probe card assembly is disclosed. The probe card assembly includes a probe card plate, a probe core, and an expansion gap defined in the probe card plate. The probe core includes a bonding portion for fixing the probe core to the probe plate. The expansion gap surrounds the probe core. Another probe card assembly is disclosed. The another probe card assembly includes a probe card plate, a tube, and a probe core. The tube is configured to be inserted into an opening of the probe card plate and configured to be securely fixed to the probe card plate. The probe core includes a bonding portion for fixing the probe core to the tube.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: A latch assembly that can lock and unlock a probe core with respect to a circuit board is provided. The latch assembly can engage with the probe core to align the probe core with respect to a circuit board, and press down the probe core against the circuit board by rotating to lock the probe core with the circuit board. An installation tool is provided to grip or release the probe core to/from a latch assembly or a probe core carrier. The installation tool can align with the probe core and/or the latch assembly to lock and unlock the probe core with respect to a circuit board.

Abstract: A probe card assembly is disclosed. The probe card assembly includes a probe card plate, a probe core, and an expansion gap defined in the probe card plate. The probe core includes a bonding portion for fixing the probe core to the probe plate. The expansion gap surrounds the probe core. Another probe card assembly is disclosed. The another probe card assembly includes a probe card plate, a tube, and a probe core. The tube is configured to be inserted into an opening of the probe card plate and configured to be securely fixed to the probe card plate. The probe core includes a bonding portion for fixing the probe core to the tube.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.

Abstract: A probe card assembly is disclosed. The probe card assembly includes a probe card plate, a probe core, and an expansion gap defined in the probe card plate. The probe core includes a bonding portion for fixing the probe core to the probe plate. The expansion gap surrounds the probe core. Another probe card assembly is disclosed. The another probe card assembly includes a probe card plate, a tube, and a probe core. The tube is configured to be inserted into an opening of the probe card plate and configured to be securely fixed to the probe card plate. The probe core includes a bonding portion for fixing the probe core to the tube.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.

Abstract: A latch assembly that can lock and unlock a probe core with respect to a circuit board is provided. The latch assembly can engage with the probe core to align the probe core with respect to a circuit board, and press down the probe core against the circuit board by rotating to lock the probe core with the circuit board. An installation tool is provided to grip or release the probe core to/from a latch assembly or a probe core carrier. The installation tool can align with the probe core and/or the latch assembly to lock and unlock the probe core with respect to a circuit board.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.

Abstract: A test apparatus for testing a semiconductor device includes a circuit board having a contact pattern on one side and an opening therethrough, and a probe card supporting a probe needle array. The probe needle array is insertable into the opening of the circuit board and is configured to probe a device under test. The probe needle array is in electrical contact with the contact pattern of the circuit board, to allow signals through the probe card and circuit board to a test equipment. A holder supports the probe card and other probe cards. The holder has multiple sides, each of which is supportable of a probe card having a probe needle array. The holder is rotatable to manipulate and position the probe needle arrays of the probe cards relative to a device under test. The holder allows disconnection and replacement of the probe needle arrays from the holder.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.