Patents by Inventor John L. Ibele

John L. Ibele has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ambient temperature ball bond
    Patent number: 8767351
    Abstract: The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: July 1, 2014
    Assignee: Seagate Technology LLC
    Inventors: Leping Li, Saravuth Keo, Kara L. Maytag, Pramit P. Parikh, Jeff R. O'Konski, Mark A. Herendeen, Joel W. Hoehn, Roger L. Hipwell, Joe J. Schobel, John L. Ibele, Ralph Marquart, Edward Knutson