Abstract: A die clamp arrangement for attaching a die member to a press slide includes an elongated attachment member rotatably and slidably attached near its upper end in guide slots of a support bracket attached to a vertical face of the press slide. In attachment position, the lower threaded end of the attachment member extends below the press slide. A pin on the attachment member rests on the press slide and a square shaped intermediate section of the attachment member is located in a like shaped slot in the press slide to thereby distribute to the press slide the compressive clamping and torque loads which result from a nut being threaded on the attachment member to secure the die member to the press slide. In a self-stored position, the elongated member is moved relative to the guide slots to engage the upper end thereof with the support bracket under the force of gravity and maintain the lower end of the attachment member free of the area below the press slide.