Patents by Inventor John L. Parker, Jr.

John L. Parker, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via connector and method of making same
    Patent number: 6598291
    Abstract: An insulator substrate or printed circuit board (PCB) having a filled and plated via. A sidewall of the via and preferably opposite sides of the insulator substrate are first plated with a conductive material. The plated via is then filled with an electrically conductive fill composition. A conductive cap layer is preferably formed over both ends of the conductive fill composition and the opposite surfaces of the insulator substrate, and can be bonded to a surface mount contact as a land or a pad.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: July 29, 2003
    Assignee: Viasystems, Inc.
    Inventors: John L. Parker, Jr., Pamela L. Miscikowski
  • Method and apparatus for solder leveling of printed circuit boards
    Patent number: 5110036
    Abstract: Disclosed is a method and apparatus for fabricating workpieces such as printed circuit boards which include blowing excess solder off the board by a hot air solder leveling technique. A converging/diverging airknife design creates a shock wave, causing a high pressure, low velocity flow pattern which removes solder from the through-holes in the board while leaving sufficient solder on the surface mount features. Additionally, a Mach number of the fluid of less than 0.8 is created.
    Type: Grant
    Filed: December 17, 1990
    Date of Patent: May 5, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: John L. Parker, Jr.
  • Method of preserving the solderability of copper
    Patent number: 4373656
    Abstract: A method for preserving the solderability of copper conductors comprises stabilizing a cleaned, mildly etched conductor surface with a phosphoric acid-glycol solution then immersing the surface in imidazole followed by a rinse to remove excess imidazole.
    Type: Grant
    Filed: July 17, 1981
    Date of Patent: February 15, 1983
    Assignee: Western Electric Company, Inc.
    Inventors: John L. Parker, Jr., Robert B. Ranes