Patents by Inventor John L. Wang

John L. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250044879
    Abstract: A voice-controlled electronic device that includes a device housing having a longitudinal axis bisecting opposing top and bottom surfaces and a side surface extending between the top and bottom surfaces. The device can further include one or more microphones disposed within the device housing and distributed radially around the longitudinal axis; a processor configured to execute computer instructions stored in a computer-readable memory for interacting with a user and processing voice commands received by the one or more microphones and first transducer and second transducers configured to generate sound waves within different frequency ranges.
    Type: Application
    Filed: October 17, 2024
    Publication date: February 6, 2025
    Applicant: Apple Inc.
    Inventors: Craig M. Stanley, Simon K. Porter, John H. Sheerin, Glenn K. Trainer, Ethan L. Huwe, Sean T. McIntosh, Jason C. Della Rosa, Christopher J. Stringer, Molly J. Anderson, Erik L. Wang
  • Patent number: 5863728
    Abstract: A DNA fragment encoding a carbohydrate binding lectin BJ38 in chromosomal DNA of Bradyrhizobium japonicum is described. The DNA is used as a source of the lectin, as a probe and as DNA for recombinant strains of rhizobium with enhanced nodulation and production in legumes.
    Type: Grant
    Filed: July 5, 1996
    Date of Patent: January 26, 1999
    Assignee: Board of Trustees operating Michigan State University
    Inventors: John Siu-Cheong Ho, John T. Loh, Melvin S. Schindler, John L. Wang
  • Patent number: 4223434
    Abstract: A method for manufacturing flexible Nb.sub.3 (Al,Ge) multifilamentary superconductive material in which a sintered porous niobium compact is infiltrated with an aluminum-germanium alloy and thereafter deformed and heat treated in a series of steps at different successively higher temperatures preferably below 1000.degree. C. to produce filaments composed of Nb.sub.3 (Al,G3) within the compact. By avoiding temperatures in excess of 1000.degree. C. during the heat treatment, cladding material such as copper can be applied to facilitate a deformation step preceding the heat treatment and can remain in place through the heat treatment to also serve as a temperature stabilizer for supeconductive material produced. Further, these lower heat treatment temperatures favor formation of filaments with reduced grain size and, hence with more grain boundaries which in turn increase the current-carrying capacity of the superconductive material.
    Type: Grant
    Filed: February 1, 1979
    Date of Patent: September 23, 1980
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: John L. Wang, Milton R. Pickus, Kent E. Douglas
  • Patent number: 4130422
    Abstract: A copper-base alloy composition consisting essentially of 85 - 89% copper, 2 - 4% manganese, and 8 - 11% silicon and use of same in liquid phase sintering of ferrous powders.
    Type: Grant
    Filed: June 16, 1977
    Date of Patent: December 19, 1978
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: John L. Wang, Milton R. Pickus, Meng-Hsiu Chen