Abstract: A multilayer thick film package for housing a microchip is formed from a series of insulating wafers. A wafer adapted to occupy an outer position on the package has a first series of apertures positioned to correspond with the placement of pins on the package, and wafers adapted to occupy inner positions on the package each have a second series of apertures. The second series of apertures is comprised of apertures that correspond in position to the first series of apertures, but is also comprised of additional apertures. Conductive material in the additional apertures allows electrical connection to be made within the package to the conductive lines that extend from the pins of the package to the inner package interface adapted to abut to a microchip. Two forms of the electrical connections are discussed.

Abstract: A rinse conditioner containing cationic surfactant and optionally other surfactants or fatty materials is prepared to relatively high viscosity at which it is stable. The process step necessary to achieve this is first to prepare a relatively mobile dispersion of the active materials and to thicken this mobile dispersion with a nonionic or weakly anionic thickener. Examples of such thickeners are guar gum, polyvinylacetate and polyacrylamide.