Patents by Inventor John Lampett

John Lampett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
    Patent number: 8622783
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: January 7, 2014
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram
  • METHOD AND SYSTEM FOR CONTROLLING CHEMICAL MECHANICAL POLISHING BY CONTROLLABLY MOVING A SLURRY OUTLET
    Publication number: 20110237161
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Application
    Filed: June 10, 2011
    Publication date: September 29, 2011
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram
  • Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet
    Patent number: 7980922
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: July 19, 2011
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram
  • METHOD AND SYSTEM FOR CONTROLLING CHEMICAL MECHANICAL POLISHING BY CONTROLLABLY MOVING A SLURRY OUTLET
    Publication number: 20080132152
    Abstract: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.
    Type: Application
    Filed: June 6, 2007
    Publication date: June 5, 2008
    Inventors: Axel Kiesel, Uwe Stoeckgen, John Lampett, Heiko Wundram