Patents by Inventor John Larson, III

John Larson, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating piezoelectric material with selected c-axis orientation
    Patent number: 9243316
    Abstract: In accordance with a representative embodiment, a method of fabricating a piezoelectric material comprising a first component and a second component comprises: providing a substrate; flowing hydrogen over the substrate; flowing the first component to form the piezoelectric material over a target; and sputtering the piezoelectric material from the target on the substrate. In accordance with another representative embodiment, a method of fabricating a bulk acoustic wave (BAW) resonator comprises: forming a first electrode over a substrate; forming a seed layer over the substrate; and depositing a piezoelectric material having a compression-negative (CN) polarity. The depositing of the piezoelectric material comprises: flowing a first component of the piezoelectric material to form the piezoelectric material over a target comprising a second component of the piezoelectric material; and sputtering the piezoelectric material from the target to the substrate.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: January 26, 2016
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: John Larson, III, Sergey Mishin
  • METHOD OF FABRICATING PIEZOELECTRIC MATERIAL WITH SELECTED C-AXIS ORIENTATION
    Publication number: 20110180391
    Abstract: In accordance with a representative embodiment, a method of fabricating a piezoelectric material comprising a first component and a second component comprises: providing a substrate; flowing hydrogen over the substrate; flowing the first component to form the piezoelectric material over a target; and sputtering the piezoelectric material from the target on the substrate. In accordance with another representative embodiment, a method of fabricating a bulk acoustic wave (BAW) resonator comprises: forming a first electrode over a substrate; forming a seed layer over the substrate; and depositing a piezoelectric material having a compression-negative (CN) polarity. The depositing of the piezoelectric material comprises: flowing a first component of the piezoelectric material to form the piezoelectric material over a target comprising a second component of the piezoelectric material; and sputtering the piezoelectric material from the target to the substrate.
    Type: Application
    Filed: January 22, 2010
    Publication date: July 28, 2011
    Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: John Larson, III, Sergey Mishin