Abstract: A structure and method for a circuitized substrate assembly that provides interface capability with high-density I/O devices, such as semiconductor devices, said structure and method providing enhanced capability for direct chip attach technology and for device interface board that perform functional and operational testing capability for semiconductor devices having an interconnect pitch down to 50 um or smaller.

Abstract: An apparatus includes a computer system programmed to retrieve information from a plurality of data sources; the computer system including a plurality of vault query services; an adapter for each of the data sources, each adapter translating an interface for one of the data sources to a vault query service interface; and a cross-vault query service providing an interface for data communication between an application program and the plurality of vault query services; and a user display for displaying the information retrieved from the data sources in response to a query from the application program.

Abstract: A direct drive servovalve (10) includes redundant drive motors (14) coupled to a common valve drive shaft (22,24) by a connection device (26). The connection device (26) is configured to allow operation of the servovalve (10) in the case where one or more of the drive motors (14) becomes inoperable, such as caused by jamming or binding of a rotor associated with the drive motor. By use of the connection device (26), in the event that one of the drive motors (14) was to become jammed, the remaining operable motors (14) can continue to stroke or cause translation of a valve member (18) of the direct drive servovalve (10) to allow its continued operation.

Abstract: A floating piston actuator for use with multiple hydraulic systems includes a housing and a piston assembly. The piston assembly includes an elongate shaft or ram, at least one secured piston coupled to the ram, and a set of moveable pistons moveably disposed within the housing chamber on the ram such that the set of moveable pistons are translatable relative to a longitudinal axis of the ram. The set of moveable pistons form at least three hydraulically separate actuator cylinders where each of the three hydraulically separate actuator cylinders are disposed in fluid communication with a corresponding pressurized fluid source. The floating piston actuator allows hydraulic redundancy while maintaining a similar length compared to existing multi-system actuators. The floating pistons can be arranged in multiple configurations to allow operation with a hydraulic system failure without force fight or binding and with a higher output force than conventional multi-system actuators.

Abstract: A direct drive servovalve (10) includes redundant drive motors (14) coupled to a common valve drive shaft (22,24) by a connection device (26). The connection device (26) is configured to allow operation of the servovalve (10) in the case where one or more of the drive motors (14) becomes inoperable, such as caused by jamming or binding of a rotor associated with the drive motor. By use of the connection device (26), in the event that one of the drive motors (14) was to become jammed, the remaining operable motors (14) can continue to stroke or cause translation of a valve member (18) of the direct drive servovalve (10) to allow its continued operation.

Abstract: A floating piston actuator for use with multiple hydraulic systems includes a housing and a piston assembly. The piston assembly includes an elongate shaft or ram, at least one secured piston coupled to the ram, and a set of moveable pistons moveably disposed within the housing chamber on the ram such that the set of moveable pistons are translatable relative to a longitudinal axis of the ram. The set of moveable pistons form at least three hydraulically separate actuator cylinders where each of the three hydraulically separate actuator cylinders are disposed in fluid communication with a corresponding pressurized fluid source. The floating piston actuator allows hydraulic redundancy while maintaining a similar length compared to existing multi-system actuators. The floating pistons can be arranged in multiple configurations to allow operation with a hydraulic system failure without force fight or binding and with a higher output force than conventional multi-system actuators.

Abstract: A hydraulic actuator is configured to provide redundant boost control to an aircraft within approximately the same space required by a single hydraulic cylinder. The hydraulic actuator includes a housing and a piston assembly disposed within the housing. The piston assembly includes a ram, a first piston secured to the ram, and second and third pistons disposed on the ram such that the second and third pistons are translatable relative to the longitudinal axis of the ram. The pistons form two hydraulically separate actuator cylinders within the space required by a single cylinder which results in a reduction in the weight and size of the hydraulic actuator.

Abstract: A hydraulic actuator is configured to provide redundant boost control to an aircraft within approximately the same space required by a single hydraulic cylinder. The hydraulic actuator includes a housing and a piston assembly disposed within the housing. The piston assembly includes a ram, a first piston secured to the ram, and second and third pistons disposed on the ram such that the second and third pistons are translatable relative to the longitudinal axis of the ram. The pistons form two hydraulically separate actuator cylinders within the space required by a single cylinder which results in a reduction in the weight and size of the hydraulic actuator.

Abstract: An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within the system. At least one electrical component is positioned on and electrically coupled to the circuitized substrate of the system's electrical assembly.

Abstract: A circuitized substrate with a conductive layer which assures enhanced adhesion of the layer to selected dielectric layers used to form the circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer.

Abstract: Apparatus for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes, conductive and dielectric layers as part thereof.

Abstract: A method of making circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device.

Abstract: A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure.

Abstract: A capacitor material including a thermosetting resin (e.g., epoxy resin), a high molecular mass flexibilizer (e.g., phenoxy resin), and a quantity of nano-particles of a ferroelectric ceramic material (e.g., barium titanate), the capacitor material not including continuous or semi-continuous fibers (e.g., fiberglass) as part thereof. The material is adapted for being positioned in layer form on a first conductor member and heated to a predetermined temperature whereupon the material will not possess any substantial flaking characteristics. A second conductor member may then be positioned on the material to form a capacitor member, which then may be incorporated within a substrate to form a capacitive substrate. Electrical components may be positioned on the substrate and capacitively coupled to the internal capacitor.

Abstract: A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.

Abstract: A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. An information handling system, e.g., a mainframe computer, which represents one of the products in which the substrate may be utilized, is also provided.

Abstract: A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.

Abstract: A method of making a printed circuit board in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.

Abstract: A method and apparatus for depositing conductive paste in openings of a circuitized substrate such as a multilayered printed circuit board to produce effective conductive thru-holes capable of being electrically coupled to selected conductive layers of the substrate. The invention comprises using vacuum to draw from the underside of the substrate while substantially simultaneously applying the paste onto the substrate's opposing surface. One example of means for accomplishing such paste application is a squeegee, and in one embodiment, two such squeegees may be used. A porous member is used to engage the substrate's undersurface during the vacuum draw, this member being positioned atop a base vacuum member through which the vacuum is drawn.

Abstract: A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include a layer of solder thereon. A method of making such a substrate is also provided, as are an electrical assembly and information handling system adapter for having such a substrate as part thereof.