Abstract: A method for measuring furnace temperatures. The method includes obtaining radiance measurements from a plurality of regions of interest (ROIs) using a plurality of thermal imaging cameras, and measuring a surface temperature using a radiance measurement obtained from an ROI selected from the plurality of ROIs. Measuring the surface temperature includes determining an effective background radiance affecting the selected ROI using radiance measurements obtained from ROIs different from the selected ROI, obtaining a compensated radiance by removing the effective background radiance from the radiance measurement obtained from the selected ROI, and converting the compensated radiance to the measured surface temperature.

Abstract: A method for measuring furnace temperatures. The method includes obtaining radiance measurements from a plurality of regions of interest (ROIs) using a plurality of thermal imaging cameras, and measuring a surface temperature using a radiance measurement obtained from an ROI selected from the plurality of ROIs. Measuring the surface temperature includes determining an effective background radiance affecting the selected ROI using radiance measurements obtained from ROIs different from the selected ROI, obtaining a compensated radiance by removing the effective background radiance from the radiance measurement obtained from the selected ROI, and converting the compensated radiance to the measured surface temperature.

Abstract: A method for measuring furnace temperatures. The method includes obtaining radiance measurements from a plurality of regions of interest (ROIs) using a plurality of thermal imaging cameras, and measuring a surface temperature using a radiance measurement obtained from an ROI selected from the plurality of ROIs. Measuring the surface temperature includes determining an effective background radiance affecting the selected ROI using radiance measurements obtained from ROIs different from the selected ROI, obtaining a compensated radiance by removing the effective background radiance from the radiance measurement obtained from the selected ROI, and converting the compensated radiance to the measured surface temperature.

Abstract: A method for measuring furnace temperatures. The method includes obtaining radiance measurements from a plurality of regions of interest (ROIs) using a plurality of thermal imaging cameras, and measuring a surface temperature using a radiance measurement obtained from an ROI selected from the plurality of ROIs. Measuring the surface temperature includes determining an effective background radiance affecting the selected ROI using radiance measurements obtained from ROIs different from the selected ROI, obtaining a compensated radiance by removing the effective background radiance from the radiance measurement obtained from the selected ROI, and converting the compensated radiance to the measured surface temperature.

Abstract: A temperature sensor utilizing optical temperature measuring techniques is constructed to make firm contact with a surface whose temperature is being measured, an example application being the monitoring of semiconductor wafers or flat panel displays while being processed. A cap is mounted near but spaced apart from an end of a lightwave guide, with a resilient element that applies force of the cap against a surface whose temperature is being measured as the cap is urged toward the optical fiber end. An optical temperature sensing element, such as luminescent material or a surface of known emissivity, is carried within the cap. A bellows with a closed end conveniently serves as both the cap and the resilient element. An alternative temperature measuring device installs an optical temperature sensing material within a test substrate behind an optical window, and then views the sensing material through the window.

Abstract: A temperature sensor utilizing optical temperature measuring techniques is constructed to make firm contact with a surface whose temperature is being measured, an example application being the monitoring of semiconductor wafers or flat panel displays while being processed. A cap is mounted near but spaced apart from an end of a lightwave guide, with a resilient element that applies force of the cap against a surface whose temperature is being measured as the cap is urged toward the optical fiber end. An optical temperature sensing element, such as luminescent material or a surface of known emissivity, is carried within the cap. A bellows with a closed end conveniently serves as both the cap and the resilient element. An alternative temperature measuring device installs an optical temperature sensing material within a test substrate behind an optical window, and then views the sensing material through the window.