Patents by Inventor John LeRoy Parker, Jr.

John LeRoy Parker, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via connector and method of making same
    Patent number: 6303881
    Abstract: An insulator substrate or printed circuit board (PCB) having a filled and plated via is provided. The plated via is filled with an electrically conductive fill composition. A conductive cap layer is formed on both ends of the conductive fill composition in the via and the major surfaces of the insulator substrate and can be bonded to a surface mount contact as a land or a pad.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: October 16, 2001
    Assignee: Viasystems, Inc.
    Inventors: John LeRoy Parker, Jr., Pamela L. Miscikowski