Patents by Inventor John Louis Palkiewicz

John Louis Palkiewicz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4101693
    Abstract: Epoxy resin compositions comprising a first epoxy resin having a relatively low epoxy equivalent weight of about 170 to 200 and an average functionality of 2 or less, a second epoxy resin having a relatively high epoxy equivalent weight of about 900 to 1900 and an average functionality of 2 or less, and a curing system. Glass fabric is impregnated with the epoxy resin composition and formed into laminates, which are especially useful in the manufacture of printed circuit boards.
    Type: Grant
    Filed: November 20, 1974
    Date of Patent: July 18, 1978
    Assignee: General Electric Company
    Inventors: Lo Kwang Tsen, John Louis Palkiewicz
  • Patent number: 4075260
    Abstract: Epoxy resin compositions comprising a first epoxy resin having a relatively low epoxy equivalent weight of about 170 to 200 and an average functionality of 2 or less, a second epoxy resin having a relatively high epoxy equivalent weight of about 900 to 1900 and an average functionality of 2 or less, and a curing system. Glass fabric is impregnated with the epoxy resin composition and formed into laminates, which are especially useful in the manufacture of printed circuit boards.
    Type: Grant
    Filed: February 13, 1976
    Date of Patent: February 21, 1978
    Assignee: General Electric Company
    Inventors: Lo Kwang Tsen, John Louis Palkiewicz