Abstract: Embodiments of the present disclosure are directed towards apparatuses, systems, and methods for die attach coatings for semiconductor packages. In one embodiment, a die may be coupled with a substrate by a die attach and a coating may be applied to an edge of the die attach.

Abstract: Embodiments include but are not limited to apparatuses and systems including a die package including a substrate, a die coupled with a top surface of the substrate, a package wall disposed on the top surface of the substrate and bounding the die, and a package lid coupled with the package wall, and including at least one protrusion facilitating a coupling of the package lid with the package wall. At least one edge of the top surface of the die pad may include an etched portion such that a width of the top surface is narrower than a width of the bottom surface. At least one edge of a top surface of at least one of the leads may include an etched portion such that a width of the top surface is narrower than a width of the bottom surface. Other embodiments may be described and claimed.

Abstract: A lateral varactor is fabricated with a recess structure that provides staggered punch-through points, enabling the varactor to be tuned through punch-through without significant non-linearities in either capacitance or Q. The lateral varactor (30) includes a cathode (32) and an anode (40) disposed on the surface of an active layer (12). The anode (40) includes a surface section (45), and a recess section (46) disposed within a recess area (50). This recess structure results in a greater active layer depth under the anode surface section (45) than under the anode recess section (46). As a result, as reverse-bias voltage on the anode increases, the depletion region (60) reaches punch-through under the anode recess section (46) prior to reaching punch-through under the anode surface section (45).