Abstract: An adaptable modular power system (AMPS) is hierarchical in a number of ways. AMPS modules connect to a backplane, and one or multiple AMPS backplanes can form an AMPS domain. At the same time, the vehicle electronics is modular, with various payload boxes needing to communicate with each other. A common power and signaling cable is provided to interconnect payload boxes. A dedicated connector system is also provided so that AMPS modules may communicate, control, receive data, and supply and receive power.

Abstract: An adaptable modular power system (AMPS) is hierarchical in a number of ways. AMPS modules connect to a backplane, and one or multiple AMPS backplanes can form an AMPS domain. At the same time, the vehicle electronics is modular, with various payload boxes needing to communicate with each other. A common power and signaling cable is provided to interconnect payload boxes. A dedicated connector system is also provided so that AMPS modules may communicate, control, receive data, and supply and receive power.

Abstract: An adaptable modular power system (AMPS) is hierarchical in a number of ways. AMPS modules connect to a backplane, and one or multiple AMPS backplanes can form an AMPS domain. At the same time, the vehicle electronics is modular, with various payload boxes needing to communicate with each other. A common power and signaling cable is provided to interconnect payload boxes. A dedicated connector system is also provided so that AMPS modules may communicate, control, receive data, and supply and receive power.

Abstract: An adaptable modular power system (AMPS) is hierarchical in a number of ways. AMPS modules connect to a backplane, and one or multiple AMPS backplanes can form an AMPS domain. At the same time, the vehicle electronics is modular, with various payload boxes needing to communicate with each other. A common power and signaling cable is provided to interconnect payload boxes. A dedicated connector system is also provided so that AMPS modules may communicate, control, receive data, and supply and receive power.

Abstract: An adaptable modular power system (AMPS) is hierarchical in a number of ways. AMPS modules connect to a backplane, and one or multiple AMPS backplanes can form an AMPS domain. At the same time, the vehicle electronics is modular, with various payload boxes needing to communicate with each other. A common power and signaling cable is provided to interconnect payload boxes. A dedicated connector system is also provided so that AMPS modules may communicate, control, receive data, and supply and receive power.

Abstract: An adaptable modular power system (AMPS) is hierarchical in a number of ways. AMPS modules connect to a backplane, and one or multiple AMPS backplanes can form an AMPS domain. At the same time, the vehicle electronics is modular, with various payload boxes needing to communicate with each other. A common power and signaling cable is provided to interconnect payload boxes. A dedicated connector system is also provided so that AMPS modules may communicate, control, receive data, and supply and receive power.

Abstract: A method for performing a wire-bonding operation in an integrated circuit utilizes a bonding tool. A wire is bonded to a first bond site in the integrated circuit, and terminated at a second bond site in the integrated circuit. The bonding and terminating steps are repeated for a plurality of additional wire bonds of the integrated circuit. At least two wire bonds in the integrated circuit are substantially perpendicular to one another at a crossing point in a plan view of the integrated circuit.

Abstract: Device packages often include walls build on a heat sink that surrounds a device die that thermally interacts with the heat sink. Use of raised or depressed feature on said heat sink that contacts the walls improves the cohesiveness of the package. By appropriately positioning these features contaminant infusion into the package is improved without degrading cohesiveness.

Abstract: Devices such as amplifiers are built on a heat sink having a perimeter wall surrounding active electronic devices. Surprisingly formation of wire bonds to such devices tends to be degraded if they have an aspect ratio greater than 2:1. This problem is overcome by forming wire bonds before such walls have a height of 30 mils and after bond formation extending the walls to their final height.

Abstract: A semiconductor device includes an IC die configured to reduce post-fabrication damage to the device. The IC die is formed such that at least a portion of one or more perimeter edges of the die are beveled by an etching process. The semiconductor device may include a plurality of IC dies, at least one of the IC dies being separated from the semiconductor device by forming one or more v-shaped grooves in an upper surface of the device, the v-shaped grooves defining perimeter edges of the at least one IC die. A back surface of the semiconductor device is removed until at least a portion of the v-shaped grooves are exposed. When the IC die is separated from the semiconductor device in this manner, a sidewall of each of the v-shaped grooves forms a beveled perimeter edge of the separated IC die.

Abstract: An integrated circuit comprises an integrated circuit package and a plurality of circuit elements disposed within the integrated circuit package. A plurality of wire bonds provide connections for at least one of the circuit elements. At least one wire bond in a first subset of wire bonds and at least one wire bond in a second subset of wire bonds are substantially perpendicular to one another at a crossing point of the wire bonds in a plan view of the integrated circuit.

Abstract: A disk mastering preview system utilizes an original audio signal from an audio source for previewing signals to be recorded by a disk lathe. Delayed audio signals corresponding to the original audio signals are produced for recording by the disk lathe a predetermined time delay thereafter. The original audio signals are sampled periodically by a sample and hold circuit to produce analog sample signals indicative of the signals sampled. An analog to digital converter converts the analog sample signals to corresponding digital sample signals. Successive digital sample signals are written into successively addressed memory locations and read out an adjustable predetermined number of memory addresses subsequently. A digital to analog converter converts the digital sample signals read out of memory into analog signals for recording. The predetermined number of addresses is set in a time delay register which produces a signal indicative of the number.

Abstract: An accessory for a jet engine for tuning turbine exhaust gases for maximum thrust capabilities in the absence of a turbine thrust reverser and cowling combination normally for and utilized thereon. The accessory comprises an inner streamlined nozzle shell forming a continuation of the outer skin of the turbine exhaust duct, a center mounted engine plug providing a path for the turbine gases between the inner nozzle surface and the engine plug outer surface and a transition adapter for mating and attaching the plug to the center of the engine. The engine plug is further provided with an opening between its engine attached and outer ends providing communication between the engine and the atmosphere adjacent the rear end of the plug. The accessory further comprises a fairing for attachment to the pylon supporting the engine to further tune the gases leaving the nozzle.