Abstract: There is provided, in a method of selective electroplating, the improvement comprising the utilization of a highly conductive electrolyte, compatible with the plating electrolyte but containing no depositable metallic ions, to form the cathode connection to the components to be plated and, in a machine for electroplating components, the improvement comprising providing the cathode connection to the components to be plated through the intermediary of a highly conductive electrolyte compatible with the plating electrolyte but containing no depositable metallic ions.

Abstract: An apparatus for use in selective plating a component, which apparatus comprises an electroplating zone, a series of movable selective plating heads in an endless chain configuration, wherein each plating head comprises an electrolyte opening, means for indexing the plating head to a component, means for engaging the component so as to expose an area to be selectively plated to electrolyte, means for releasably sealing the rear of the component in the region of the area to be plated, means for fastening the sealing means prior to the entry of the plating head into the electroplating zone and means for releasing the sealing means after the plating head leaves the electroplating zone, resilient or slidable couplings provided between the plating heads and means provided in the electroplating zone for supplying electrolyte to the area to be selectively plated, as well as a method of selective plating a component, which method comprises: providing an electroplating zone and moving through the electroplating zone a