Patents by Inventor John M. Dangler

John M. Dangler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMC SHIELDING FOR PRINTED CIRCUITS USING FLEXIBLE PRINTED CIRCUIT MATERIALS
    Publication number: 20090213565
    Abstract: Exemplary embodiments of the present invention relate to a method for making multilayer flexible printed circuit carrier. The method comprises producing a first flexible conductor layer having a first width, producing a second flexible conductor layer having a second width larger than the first width, and separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator. The method also comprises placing a second insulator over at least a portion of a second surface of the first flexible conductor, and wrapping a portion of the second flexible conductor over the at least a portion of the second surface of the first flexible conductor.
    Type: Application
    Filed: February 27, 2008
    Publication date: August 27, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Roger A. Booth, Jr., John M. Dangler, Matthew S. Doyle