Abstract: Preformed dielectric spacers for separating integrated circuit components and methods of forming are disclosed. A spacer wafer may be molded from a dielectric material and subsequently singulated to form a plurality of individual spacers. The molded spacer wafer may be affixed to a die attach film and film frame, and the wafer may be sawed or scored to singulate the spacers. In other embodiments, a plurality of spacers may be stamped or otherwise cut from a preformed sheet, or the spacers may be individually molded.