Patents by Inventor John M. Deuber

John M. Deuber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4088549
    Abstract: Disclosed is an aqueous electroplating bath and process for obtaining bright deposits of silver-gold alloys. The bath contains a polyakylene imine and an alkylene polyamine.
    Type: Grant
    Filed: April 13, 1976
    Date of Patent: May 9, 1978
    Assignee: Oxy Metal Industries Corporation
    Inventors: John M. Deuber, Peter Stevens
  • Patent number: 4066517
    Abstract: Disclosed is a palladium electroplating bath and a method of plating therewith. The bath contains palladium as the palladosammine chloride and a phosphonic compound which is an alkylene diamine phosphonate derivative. The bath may be employed to plate palladium or its alloys. In a preferred embodiment, a pure palladium deposit may be obtained which exhibits very low porosity even after subsequent cold forming of the article on which it is deposited.
    Type: Grant
    Filed: March 11, 1976
    Date of Patent: January 3, 1978
    Assignee: Oxy Metal Industries Corporation
    Inventors: Peter Stevens, John M. Deuber
  • Patent number: 3990954
    Abstract: Disclosed is an improved electroplating bath and process for obtaining semi-bright to bright electrodeposits of gold and gold alloys. The electroplating bath contains a gold sulfite complex and a nitrogen-free diphosphonic compound having at least two phosphonic groups attached directly to a carbon atom. Presence of the nitrogen-free phosphonate compound enhances the stability of the gold sulfite baths and improves the brightness of electrodeposits obtained therefrom.
    Type: Grant
    Filed: December 17, 1973
    Date of Patent: November 9, 1976
    Assignee: Oxy Metal Industries Corporation
    Inventors: Donald G. Foulke, John M. Deuber