Patents by Inventor John M. Devine

John M. Devine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit-board mounted clip for electromagnetic interference reduction
    Patent number: 6525266
    Abstract: An Electromagnetic Interference (EMI) shielding system including a conductive clip for electrically coupling a printed circuit board (PCB) to a grounding structure. The clip includes a first contact section attached to a side rather than an edge of the PCB, and a second contact section for contacting the grounding structure. The clip is compressible to ensure a tight fit of the second contact section to the grounding structure. The clip may be formed as a unitary structure and includes transition regions between the first and second contact sections that provide flexibility to the structure. Edge flaps may optionally be included to enhance surface contact of the clip to the PCB. The second contact region is preferably designed with a flat top surface to enable automated surface mounting.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: February 25, 2003
    Assignee: Enterasys Networks, Inc.
    Inventors: William M. Ferland, Martin Q. Thornton, Edward J. Wilson, John M. Devine
  • CIRCUIT-BOARD MOUNTED CLIP FOR ELECTROMAGNETIC INTERFERENCE REDUCTION
    Publication number: 20030015331
    Abstract: An Electromagnetic Interference (EMI) shielding system including a conductive clip for electrically coupling a printed circuit board (PCB) to a grounding structure. The clip includes a first contact section attached to a side rather than an edge of the PCB, and a second contact section for contacting the grounding structure. The clip is compressible to ensure a tight fit of the second contact section to the grounding structure. The clip may be formed as a unitary structure and includes transition regions between the first and second contact sections that provide flexibility to the structure. Edge flaps may optionally be included to enhance surface contact of the clip to the PCB. The second contact region is preferably designed with a flat top surface to enable automated surface mounting.
    Type: Application
    Filed: July 17, 2001
    Publication date: January 23, 2003
    Inventors: William M. Ferland, Martin Q. Thornton, Edward J. Wilson, John M. Devine