Patents by Inventor John M. Heck

John M. Heck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210132306
    Abstract: An optical system can include a optical receiver comprising an optical waveguide, an optical lid adjacent the waveguide, and a reflective surface proximate an output of the optical waveguide to direct light from the waveguide towards an output of the optical lid. The optical system can also include a photodetector (PD) die comprising a substrate, a concave mirror, and a photodetector. The concave mirror is formed on a first side of the substrate and the photodetector is disposed on a second side of the substrate, the first side opposite the second side, wherein the photodetector is disposed on the second side of the PD die offset from the optical axis of the optical element.
    Type: Application
    Filed: December 11, 2020
    Publication date: May 6, 2021
    Applicant: Intel Corporation
    Inventors: Alexander Krichevsky, John M. Heck
  • Patent number: 7324350
    Abstract: An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: January 29, 2008
    Assignee: Intel Corporation
    Inventors: John M. Heck, Tsung-Kuan Allen Chou, Joseph S. Hayden, III
  • Patent number: 7170155
    Abstract: An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.
    Type: Grant
    Filed: June 25, 2003
    Date of Patent: January 30, 2007
    Assignee: Intel Corporation
    Inventors: John M. Heck, Tsung-Kuan Allen Chou, Joseph S. Hayden, III
  • Publication number: 20040264152
    Abstract: An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.
    Type: Application
    Filed: June 25, 2003
    Publication date: December 30, 2004
    Inventors: John M. Heck, Tsung-Kuan Allen Chou, Joseph S. Hayden